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Thermal Grizzly

Thermal Grizzly Minus Pad Extreme 120x20x1.5

SKU CH-65KA-JTVGE

Silicone thermal pad measuring 120 × 20 × 1.5 mm with 260 % higher conductivity than the Minus Pad 8 for consoles, laptops and PCs

  • Excellent heat dissipation for consoles and MacBooks
  • Silicone pad with modelling-clay consistency fills gaps
  • 260% more thermal conductivity than Minus Pad 8
  • Ideal where thermal paste cannot bridge large gaps
  • Designed for office, home and gaming PCs

Thermal pad for PCs, laptops and consoles

Thermal Grizzly Minus Pad Extreme is a silicone-based thermal pad measuring 120x20x1.5 mm. It is designed to fill gaps between heatsinks and hot components where thermal paste cannot be used. The pad suits office, home and gaming systems as well as PS3, PS4, PS5, Xbox 360, One, Series X and Macbooks.

Who should use this and who should not

Builders who need a soft, clay-like pad to bridge uneven surfaces or large air gaps will benefit from the improved design. Buyers who require a liquid compound for direct die contact or thin bond lines should look at thermal paste instead. Users needing a different thickness or plan area must choose another size.

Thermal conductivity improvement

The revised Minus Pad Extreme delivers approximately 260% more thermal conductivity than the earlier Minus Pad 8. This increase allows the pad to compensate for even the most invisible gaps between components. The figure is the key specification that determines whether this pad meets the thermal resistance target for a given assembly.

Highlights

  • Excellent heat dissipation for consoles and MacBooks
  • Silicone pad with modelling-clay consistency fills gaps
  • 260% more thermal conductivity than Minus Pad 8
  • Ideal where thermal paste cannot bridge large gaps
  • Designed for office, home and gaming PCs

Specifications

No published specifications for this item yet.

Questions about this item

What does the 13 W/mK conductivity mean once the pad is installed in a machine?

The 13 W/mK rating means the pad moves heat across gaps far more effectively than standard pads, lowering component temperatures under sustained loads.

How does the silicone-based interface perform in practice and what limits it?

The silicone material stays pliable like modelling clay, filling uneven surfaces without pump-out, but it cannot match the absolute peak conductivity of liquid metal pastes.

What physical space and mounting clearance does the 120×20×1.5 mm pad need?

The pad measures 120 mm by 20 mm by 1.5 mm thick, so it fits any gap that can accommodate those exact dimensions and compresses slightly under heatsink pressure.

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