Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Thermal Grizzly
Two 100 x 100 mm pads, 1.5 mm thick, non-conductive thermal interface for SSDs, GPUs and other electronics
Thermal Grizzly Minus Pad Basic pads provide a non-conductive thermal interface for solid-state drives, graphics card coolers and other board-level components. The 100 x 100 mm sheets can be cut to match the exact area of each chip or module. Two pads are included in the pack for multiple installation points.
The pads deliver good thermal conductivity to move heat away from memory modules and voltage regulators under normal loads. Being electrically non-conductive eliminates the risk of short circuits if material bridges adjacent contacts. Lower compressibility compared to higher-tier variants means the pads retain shape during repeated mounting cycles.
Each 1.5 mm thick sheet fits standard gap heights found on many SSD and GPU cooler designs without additional shimming. The material is ready to use straight from the package and requires no curing time or special tools. Users needing higher compressibility or maximum conductivity may prefer the Advance or Pro series instead.
| Brand | Thermal Grizzly |
|---|---|
| Model | TG-MP-B-100-100-15-2 |
| Part Number | TG-MP-B-100-100-15-2 |
| Features | Thermal Grizzly Minus Pad Basic thermal pads are part of the Basic, Advance, and Pro series. The Basic pads are easy to use, provide good thermal conductivity, slightly lower compressibility, and offer an excellent price-performance Ratio. |
Cut the 100 x 100 mm sheet to size, peel both protective films, place the pad on the clean component, then mount the heatsink with even pressure so the 1.5 mm gap fills without air pockets.
The electrically non-conductive silicone compound does not dry out; plan to replace it only when you disassemble the cooler or if the pad is torn during a future upgrade.
The pad’s good thermal conductivity and slightly lower compressibility mean the component’s own thermal throttle point will be reached before the pad saturates.
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