Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Thermal Grizzly
Two 100 x 100 x 1.0 mm electrically non-conductive thermal pads for SSDs, GPUs and other electronics
Thermal Grizzly Minus Pad Basic is a two-pack of electrically non-conductive thermal interface pads. Each black pad measures 100 x 100 mm with a 1.0 mm thickness. They are designed to transfer heat from SSDs, GPU coolers, water blocks, voltage regulators and memory modules. The Basic series offers good thermal conductivity and an excellent price-performance ratio for builders and upgraders.
Verify that the components you intend to cool have gap heights compatible with a 1.0 mm pad. Ensure the mating surfaces are clean and flat so the pad can make full contact. Confirm that the 100 x 100 mm dimensions can be trimmed or applied without covering adjacent circuitry. The pads are non-conductive, eliminating the risk of shorts if they overlap exposed traces.
The pads sit between a heat source and a heatsink, backplate or water-block cold plate to fill microscopic air gaps. They require no curing time and can be cut to shape with scissors for smaller devices. Once installed they free the builder from handling liquid pastes and simplify future maintenance because they lift away cleanly. They work alongside active cooling solutions such as fans or liquid loops.
| Brand | Thermal Grizzly |
|---|---|
| Model | TG-MP-B-100-100-10-2 |
| Part Number | TG-MP-B-100-100-10-2 |
| Features | Thermal Grizzly Minus Pad Basic thermal pads are part of the Basic, Advance, and Pro series. The Basic pads are easy to use, provide good thermal conductivity, slightly lower compressibility, and offer an excellent price-performance Ratio. |
The pack contains two black thermal pads measuring 100 x 100 mm at 1.0 mm thickness. No additional materials are needed for installation.
The Basic version offers good thermal conductivity with slightly lower compressibility and an excellent price-performance ratio. Advance improves conductivity and compressibility, while Pro provides outstanding conductivity and exceptional compressibility.
The 1.0 mm pad fills gaps between the component and cooler, ensuring electrically non-conductive contact for effective heat transfer on SSDs, GPU coolers or memory modules.
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