Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Thermal Grizzly
A pair of 100 x 100 mm thermal pads, 0.5 mm thick, electrically non-conductive for SSDs, GPUs and other electronics
The Minus Pad Basic is a thermal interface pad sized at 100 x 100 mm with a thickness of 0.5 mm. It is designed for builders who need to transfer heat from components such as SSDs, GPU coolers, water blocks, voltage regulators and memory modules. The electrically non-conductive material prevents shorts while delivering good thermal conductivity for high-performance systems. This two-pack supplies enough material for multiple applications.
The pad dimensions match common SSD and GPU memory layouts, allowing direct placement without cutting in many cases. Its compressibility fills microscopic gaps between the die and heatsink, improving contact where thermal paste would be impractical or messy. Because it is non-conductive, it can bridge exposed circuitry safely. The sheet format lets you trim custom shapes for smaller chips or voltage-regulator arrays.
Under continuous workloads the pad maintains stable thermal resistance, moving heat away from the component into the cooler without drying out or pumping out over time. The Basic series offers slightly lower compressibility than the Advance or Pro variants, so it performs best where clamping pressure is consistent. It suits long gaming sessions, render jobs or server duties where the interface must stay reliable for months without reapplication.
| Brand | Thermal Grizzly |
|---|---|
| Model | TG-MP-B-100-100-05-2 |
| Part Number | TG-MP-B-100-100-05-2 |
| Features | Thermal Grizzly Minus Pad Basic thermal pads are part of the Basic, Advance, and Pro series. The Basic pads are easy to use, provide good thermal conductivity, slightly lower compressibility, and offer an excellent price-performance Ratio. |
Each pad is 0.5 mm thick, so it adds exactly that gap when placed between the component and the cooler.
The pads are rated for good thermal conductivity and are designed to transfer heat effectively under sustained loads on SSDs, GPUs and other components.
No additional thermal compound is required; the electrically non-conductive pads are applied directly between the component and the heatsink.
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