Thermal Grizzly
Thermal Grizzly Minus Pad 8 thermal pad 100x100x2.0mm
A flexible silicone thermal pad sized 100x100x2.0mm that bridges uneven gaps between heatsinks and components using ceramic silicone with nano-aluminum oxide for high conductivity
- Ceramic silicone and nano-aluminum oxide formula delivers high thermal conductivity
- Flexible 2.0 mm thickness compensates for uneven surfaces and small gaps
- Self-adhesive design attaches with light pressure for easy installation
- 100 x 100 mm size suits CPUs, GPUs, RAM and console components
- Ideal where thermal paste cannot bridge large air gaps or uneven substrates
Thermal Pad for CPUs GPUs Consoles
Thermal Grizzly Minus Pad 8 is a silicone thermal pad sized 100x100x2.0mm. It uses a ceramic silicone and nano-aluminum oxide formula for high thermal conductivity. The flexible material fills microscopic gaps between a heatsink and heat source. It suits PCs laptops and consoles where thermal paste cannot bridge large or uneven gaps.
Builders Needing Gap-Filling Conduction
This pad serves users who need a compliant interface for memory modules VRMs or console APUs with uneven surfaces. The self-adhesive surface simplifies placement during assembly or repair. Buyers who require the highest possible conductivity for a flat CPU die should look at liquid metal or premium pastes instead.
2.0mm Thickness Determines Fit
The 2.0mm thickness is the critical dimension that decides compatibility with your specific component stack. Measure the exact gap between the die and heatsink before ordering. A pad that is too thick prevents mounting pressure while one that is too thin leaves air pockets.
Highlights
- Ceramic silicone and nano-aluminum oxide formula delivers high thermal conductivity
- Flexible 2.0 mm thickness compensates for uneven surfaces and small gaps
- Self-adhesive design attaches with light pressure for easy installation
- 100 x 100 mm size suits CPUs, GPUs, RAM and console components
- Ideal where thermal paste cannot bridge large air gaps or uneven substrates
Specifications
No published specifications for this item yet.
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