Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Thermal Grizzly
High-performance thermal compound with 11.8 W/mK conductivity for water-cooling and overclocking, non-conductive and silicone-free in a 1g syringe
Thermal Grizzly Hydronaut is a 1g syringe of grey thermal compound rated at 11.8 W/mK thermal conductivity and 0.0076 K/W thermal resistance. It contains no electrically conductive particles and requires no curing time. The silicone-free formula stays flexible across an operating range of -200°C to +350°C.
The paste viscosity sits between 140 and 190 Pas at a density of 2.6 g/cm³, so it spreads best under even pressure from a secured cold plate or water block. Ensure both CPU heatspreader and block base are clean, flat and free of old compound residue before application. No electrical conductivity means accidental smears near components will not cause shorts.
A single gram covers multiple installations on mainstream desktop sockets or larger server heatspreaders. The non-curing consistency lets you remount the block without replacing the paste each time. It is suited to overclocking scenarios where sustained heat loads demand stable thermal resistance across wide temperature swings. Builders needing only a tiny dab for a laptop or small-form-factor chip may find the 1g volume more than necessary.
| Brand | Thermal Grizzly |
|---|---|
| Model | TG-H-001-RS |
| Part Number | TG-H-001-RS |
| Specifications | 1 gram |
| Features | Hydronaut can be used for overclocking due to it's excellent thermal conductivity. |
The package contains a 1 gram syringe of gray silicone-free paste; no spreader or cleaning wipes are included, so you will need a lint-free cloth and isopropyl alcohol to prepare the surfaces.
One gram typically covers several CPU or GPU applications; for a single processor install it is usually sufficient, while multiple builds or large cold-plate areas may require an additional syringe.
It indicates very high heat-transfer capability, so when used between a CPU or GPU and a water-block or large air cooler it helps keep core temperatures lower under heavy load.
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