Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Thermal Grizzly
Liquid metal thermal compound with 12.5 W/mK conductivity for CPU and GPU cooling, 5.0 g net weight
Thermal Grizzly Conductonaut is a liquid metal thermal interface material supplied in a 5.0 g syringe. It is designed for enthusiasts and professionals who want the highest possible heat transfer between a CPU or GPU die and a cooler cold plate. The compound uses a gallium-based alloy to achieve extremely high thermal conductivity.
This product suits users who are comfortable with the risks of liquid metal, including electrical conductivity and potential corrosion of aluminium surfaces. It is not for beginners who prefer a forgiving, non-conductive paste, nor for anyone using an aluminium heatsink base because the alloy will damage aluminium.
The headline thermal conductivity of 12.5 W/mK determines whether this compound meets the performance target for a given overclocking or silent-build scenario. Buyers who need a lower-conductivity, non-conductive alternative should consider conventional ceramic or carbon-based pastes instead.
| Brand | Thermal Grizzly |
|---|---|
| Series | liquid metal |
| Model | Conductonaut 5g |
| Volume / Net Weight | 5.0g |
| Thermal Conductivity | 12.5 W/mK |
| Long Term Operating Temperature | -10 c/+140 C |
| Specifications | - Thermal conductivity: 73w/mk - viscosity: 00021 pas - density: 6,24g/cm3 - using temperature range: 10 c/+140 C - net content: 5g |
The 5.0 g syringe is designed for multiple applications on both a CPU and a GPU, so a single tube covers both components with margin left over.
It indicates very high thermal conductivity, allowing the liquid metal to fill microscopic gaps and move heat from the processor to the cooler far more effectively than standard pastes.
The liquid metal must not contact aluminium cold plates because it causes rapid corrosion; use only copper or nickel-plated bases to avoid damage.
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