Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Thermal Grizzly
Reusable carbon-fibre thermal pad sized 32x32x0.2 mm for Intel 115x CPUs, offering high conductivity without drying out
The Thermal Grizzly Carbonaut is a carbon-fibre thermal pad sized 32×32×0.2 mm for Intel desktop CPUs on socket 115 platforms such as the 6700K, 7700K and 9900K. It replaces mid-range thermal paste with a reusable, highly elastic sheet that conforms to microscopic surface gaps. The pad delivers high thermal conductivity at very low contact pressure and does not dry out over time.
This pad suits builders who prefer a clean, reusable thermal interface and who are working with the listed Intel CPUs. It is not suited for AMD desktop sockets such as those used by the 1800X, 2700X, 6950X, 7900X or 7980XE, which require the larger 38×38 mm size. Buyers needing electrical insulation must avoid this product because Carbonaut is electrically conductive. It also does not fit CPUs outside the specified socket 115 group.
Installation is straightforward: remove the protective film, place the pad on the CPU heatspreader and mount the cooler. The soft, gap-filling material conforms without spreading tools. The main risk is accidental electrical contact; because the pad is conductive, any overflow onto the motherboard or CPU pins can cause a short. Keep the pad strictly within the heatspreader area and handle with care.
| Brand | Thermal Grizzly |
|---|---|
| Model | TG-CA-32-32-02-R |
| Part Number | TG-CA-32-32-02-R |
| Specifications | 1 piece |
| Features | The Carbonaut high-tech carbon pads are excellent as an alternative for thermal conductive pastes. They are reusable and have a very elastic and adaptable surface with very high thermal conductivity. |
Yes, the 32 x 32 mm size is listed for Intel desktop CPUs on 115x sockets including the 6700K, 7700K and 9900K.
The pad is reusable and its elastic surface adapts to both CPUs, so you can move it between those 115x processors.
The 0.2 mm thickness compresses under very low pressure; even, gap-free coverage across the 32 x 32 mm surface shows it is working.
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