Supermicro
Supermicro SYS-510P-MR 1U rackmount barebone server
A 1U rackmount barebone for a single LGA 4189 Xeon up to 220 W, with eight DDR4-3200 slots, four 3.5" NVMe/SATA hot-swap bays, ten SATA 600 ports and a PCI-E 4.0 x16 slot
- Form Factor1U Rackmount
- WorkloadGeneral Purpose Server
- CPU TypeIntel Xeon
- CPU SocketLGA 4189
- Installed CPUNo CPU Installed
- Memory Slots8 x 288Pin
- Single-socket 3rd-gen Xeon up to 220W TDP for high-density compute
- 8 DDR4-3200 slots support up to 3TB with ECC for large workloads
- 4 hot-swap 3.5" NVMe/SATA bays enable flexible high-speed storage
- PCI-E 4.0 x16 plus two PCI-E 3.0 x4 M.2 slots for expansion
- Dedicated IPMI LAN plus dual 1GbE for remote management and networking
1U rackmount barebone for custom builds
The Supermicro SYS-510P-MR is a 1U rackmount server barebone designed for general-purpose workloads such as small business hosting, email, firewall or print services. It accepts a single LGA 4189 socket Intel Xeon processor with a thermal design power up to 220 W. No CPU or memory is installed, so integrators choose the exact components their application requires.
Four hot-swap bays and front USB 3.2 Gen 1
Four 3.5-inch hybrid drive bays support both NVMe and SATA devices for flexible storage configurations. A single front USB 3.2 Gen 1 port provides quick local access. The ASPEED AST2600 BMC handles remote management over a dedicated IPMI LAN port, while two 1 GbE RJ45 ports serve production traffic.
PCI-E 4.0 x16 and dual M.2 slots under load
A full-height half-length PCI-E 4.0 x16 slot and two PCI-E 3.0 x4 M-key slots (2280 and 22110) accommodate accelerators or fast networking cards. Ten SATA 600 ports with RAID 0, 1, 5 and 10 support high-throughput arrays. Builders who need more than eight DIMM slots, redundant power supplies or 2.5-inch bay density should evaluate larger chassis options.
Highlights
- Single-socket 3rd-gen Xeon up to 220W TDP for high-density compute
- 8 DDR4-3200 slots support up to 3TB with ECC for large workloads
- 4 hot-swap 3.5" NVMe/SATA bays enable flexible high-speed storage
- PCI-E 4.0 x16 plus two PCI-E 3.0 x4 M.2 slots for expansion
- Dedicated IPMI LAN plus dual 1GbE for remote management and networking
Specifications
| Brand | SUPERMICRO |
|---|---|
| Series | SuperServer |
| Model | SYS-510P-MR |
| Form Factor | 1U Rackmount |
| Workload | General Purpose Server |
| CPU Type | Intel Xeon |
| CPU Socket | LGA 4189 |
| Installed CPU | No CPU Installed |
| Memory Slots | 8 x 288Pin |
| Installed Memory Size | No Memory Installed |
| Max Memory Supported | UP to 2TB: 8 x 256 GB DRAM UP to 3TB: 4 x 256 GB DRAM and 4 x 512 GB PMem |
| ECC Supported | Yes |
| Serial ATA | 10 x SATA 600 |
| SATA RAID | RAID 0/1/5/10 |
| GPU/VPU | ASPEED AST2600 BMC |
| PCI Express | PCI-E 4.0 x16 FHHL 2 x PCI-E 3.0 x4 and SATA, M-key, 2280, 22110 |
| Hot-Swap Bays | 4 x 3.5" NVMe/SATA drive bays (4 x 3.5" NVMe hybrid) |
| Front USB | 1 x USB 3.2 Gen 1 |
| COM | 2 COM Port(s) (1 header; 1 rear) |
| VGA | 1 |
| Rear USB | 2 x USB 3.2 Gen 1 2 x USB 2.0 |
| RJ45 | 1 RJ45 Dedicated IPMI LAN port 2 RJ45 1GbE LAN ports |
| Dimensions | 1.70" x 17.20" x 19.98" |
| Weight | 17.60 lbs. |
| Shipping weight | 13.79 kg |
| Package size | 749 × 610 × 216 mm |
Questions about this item
How do I install a CPU into the LGA 4189 socket on this 1U barebone server?
Align the processor notches with the socket keys, lower it gently without forcing, close the load plate and torque the captive screws in a diagonal pattern to the specified pressure; the step often missed is applying even pressure across all four corners before locking the lever.
What memory modules will need replacement if I want to reach the 3 TB maximum with persistent memory?
Populate four slots with 512 GB Intel DCPMM and the remaining four with 256 GB DDR4-3200 RDIMM or LRDIMM; the DCPMM units are the components that wear out and must be swapped when they reach their write endurance limit.
Which thermal limit appears first when the installed Xeon runs at 220 W TDP continuously in this 1U chassis?
The 220 W CPU TDP combined with the 1.70" height restricts airflow, so the processor will hit its thermal throttle point before the chassis fans reach maximum speed.
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