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Silver 4U rackmount server chassis with front drive bays and ventilation grilles

Supermicro

Supermicro SYS-420GP-TNAR 4U barebone server

SKU CH-5XT5-PB032 MPN SYS-420GP-TNAR

A 4U rackmount barebone for AI, ML and HPC workloads supporting dual 3rd Gen Intel Xeon Scalable CPUs, up to 8TB DDR4 ECC memory and eight NVIDIA HGX A100 GPUs with NVLink interconnect

  • Form Factor4U Rackmount
  • WorkloadAI/ML/HPC
  • CPU Type3rd Gen Intel Xeon Scalable processors Up to 40C/80T; Up to
  • CPU SocketDual Socket P+ (LG-4189)
  • Installed CPUNo CPU Installed
  • Max Processors2
  • Dual 3rd Gen Xeon sockets scale AI training to 40 cores and 80 threads
  • 32 DDR4 slots support up to 8 TB ECC memory for large datasets
  • Eight NVIDIA HGX A100 GPUs connected by NVLink and NVSwitch for massive parallelism
  • Ten PCIe 4.0 x16 low-profile slots plus OCP 3.0 give flexible high-speed I/O
  • Six 2.5-inch hot-swap bays plus two M.2 slots handle NVMe, SATA or SAS storage

Purpose-built AI/HPC barebone

The Supermicro SYS-420GP-TNAR is a 4U rackmount barebone designed for AI/ML/HPC workloads. It targets organisations building dense GPU clusters for large-scale training or inference. The platform accepts dual 3rd Gen Intel Xeon Scalable processors up to 40C/80T each and supports eight NVIDIA HGX A100 SXM GPUs with NVLink and NVSwitch interconnect. Buyers needing only CPU compute or fewer than four GPUs will find the chassis oversized.

Thermals and power

Four heavy-duty fans with optimal fan speed control cool CPUs rated up to 270W TDP and eight high-power SXM GPUs in a 4U envelope. Air-cooled operation is specified for the supported processor range. No liquid-cooling infrastructure is included. Deployments requiring lower acoustic output or stricter power budgets should evaluate alternative form factors.

Expansion and storage flexibility

Ten PCIe 4.0 x16 low-profile slots plus AIOM/OCP 3.0 support provide extensive networking and accelerator options. Storage comprises six 2.5" hot-swap bays accepting NVMe, SATA or SAS drives and two M.2 slots configurable for NVMe or SATA3. SATA RAID 0/1/5/10 is available on the chipset. Systems needing 3.5" drive bays or more than two M.2 devices require a different chassis.

Highlights

  • Dual 3rd Gen Xeon sockets scale AI training to 40 cores and 80 threads
  • 32 DDR4 slots support up to 8 TB ECC memory for large datasets
  • Eight NVIDIA HGX A100 GPUs connected by NVLink and NVSwitch for massive parallelism
  • Ten PCIe 4.0 x16 low-profile slots plus OCP 3.0 give flexible high-speed I/O
  • Six 2.5-inch hot-swap bays plus two M.2 slots handle NVMe, SATA or SAS storage

Specifications

BrandSUPERMICRO
SeriesSuperServer
ModelSYS-420GP-TNAR
Form Factor4U Rackmount
WorkloadAI/ML/HPC
CPU Type3rd Gen Intel Xeon Scalable processors
Up to 40C/80T; Up to 60MB Cache per CPU
CPU SocketDual Socket P+ (LG-4189)
Installed CPUNo CPU Installed
Max Processors2
CPU FeaturesSupports up to 270W TDP CPUs (Air Cooled)
North BridgeIntel C621A
Memory Slots32 x 288Pin
Installed Memory SizeNo Memory Installed
Max Memory SupportedUP to 8TB: 32x 256 GB DRAM
UP to 12TB: 16x 512 GB PMem
Memory Type SupportedMemory Type: 3200/2933/2666MHz ECC DDR4 RDIMM/LRDIMM
Intel Optane persistent memory 200 series
ECC SupportedYes
Installed HDDNo Storage Installed
SATA RAIDRAID 0/1/5/10
M.22 x M.2 NVMe OR 2 x M.2 SATA3
GPU/VPUMax GPU Count: 8 onboard GPU(s)
Supported GPU: NVIDIA SXM: HGX A100 8-GPU (80GB)
CPU-GPU Interconnect: PCIe 4.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect: NVIDIA NVLink with NVSwitch
PCI Express10 PCIe 4.0 x16 LP slot(s)
Hot-Swap Bays6 x 2.5" hot-swap NVMe/SATA/SAS drive bays (6 x 2.5" NVMe hybrid; 4 x 2.5" NVMe dedicated)
VGA1
TemperatureOperating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature: 40°C to 60°C (40°F to 140°F)
HumidityOperating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Dimensions6.90" x 17.60" x 35.40"
Weight166.00 lbs.
Shipping weight102.06 kg
Package size1140 × 749 × 696 mm

Questions about this item

How are the 3rd Gen Intel Xeon Scalable CPUs installed in the Dual Socket P+ (LG-4189) sockets, and what step is often missed?

Align each processor with the socket keys, lower the carrier gently, and torque the retention screws in the prescribed sequence; skipping the torque sequence can leave uneven contact and cause boot failures.

Which components will need replacement first under continuous AI/ML/HPC workloads in this 4U rackmount barebone?

The four heavy-duty system fans are the primary wear items; their bearings degrade with sustained high-RPM operation, so plan fan-module swaps during scheduled maintenance windows.

What thermal limit appears first when both CPUs run at 270W TDP and eight GPUs are fully loaded?

The air-cooled 270W-per-CPU ceiling is reached before the chassis airflow can dissipate the combined CPU and GPU heat, triggering throttling to protect the processors.

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