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White 20g tube of ceramic silicone thermal paste

STARTECH

STARTECH HEATGREASE20 20g thermal paste

SKU CH-SHE5-4YAG1 MPN HEATGREASE20

A 20 g ceramic-based thermal compound rated at 1.06 W/mK that fills microscopic gaps between a CPU and heatsink for improved heat transfer

  • Volume / Net Weight20g
  • Thermal Conductivity1.06 W/mK
  • SpecificationsColor: White Bleed: <0.05% at 200°C/24 hours Evaporation: <0
  • FeaturesCeramic-based compound containing silicone Thermal conductiv

Weight White Thermal Paste

  • Improves CPU-to-heatsink heat transfer for cooler operation
  • Ceramic-based silicone compound is electrically non-conductive for safe use
  • Thermal conductivity of 1.06 W/mK enables efficient heat dissipation
  • Low bleed under 0.05% at 200°C for 24 hours maintains performance
  • 20g tube provides enough compound for multiple applications

20g Ceramic Thermal Paste

The StarTech HEATGREASE20 is a 20g tube of white ceramic-based compound designed to improve heat transfer between a CPU and heatsink. It uses silicone and metal oxide fillers to fill microscopic surface imperfections that trap air. The electrically non-conductive formula prevents short circuits if paste contacts surrounding components. It suits system builders and technicians performing CPU cooler installations or maintenance.

Simple Syringe Application

The paste dispenses from a tube directly onto the processor heat spreader for manual spreading or pressure mounting. Its ceramic-silicone consistency resists separation during storage and stays pliable during installation. Low bleed of under 0.05 percent after 24 hours at 200°C means minimal pump-out over thermal cycles. Evaporation loss stays below 0.001 percent under the same test, so reapplication intervals remain long.

Conductivity Limits for Standard Cooling

Thermal conductivity reaches 1.066 W/mK with resistance under 0.195 °C-m2/W, suitable for stock and moderate overclocking scenarios. The material cannot match the heat flow of liquid metal or high-end carbon pastes used in extreme cooling. Builders targeting maximum frequency headroom on high-wattage CPUs will need higher-conductivity alternatives. The compound contains no electrically conductive metals, eliminating bridging risk on exposed dies or substrates.

Highlights

  • Improves CPU-to-heatsink heat transfer for cooler operation
  • Ceramic-based silicone compound is electrically non-conductive for safe use
  • Thermal conductivity of 1.06 W/mK enables efficient heat dissipation
  • Low bleed under 0.05% at 200°C for 24 hours maintains performance
  • 20g tube provides enough compound for multiple applications

Specifications

BrandStarTech.com
ModelHEATGREASE20
Volume / Net Weight20g
Thermal Conductivity1.06 W/mK
SpecificationsColor: White
Bleed: <0.05% at 200°C/24 hours
Evaporation: <0.001% at 200°C/24 hours
Materials: Silicone Compounds 50% Carbon Compounds 20% Metal Oxide Compounds 30%
Thermal Resistance: <0.195°C-m2/W
Thermal Conductivity: >1.066 W/(m·K)
FeaturesCeramic-based compound containing silicone
Thermal conductivity of more than 1.066 W/m-K
Shipping weight0.03 kg
Package size149 × 84 × 25 mm

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Questions about this item

How can I verify the thermal paste is working correctly after applying it to the CPU?

Monitor CPU temperatures under load; effective heat transfer between the processor and heatsink should keep the CPU running cooler.

What does the 20g tube contain and is a spreader tool included?

The tube holds 20g of white ceramic-based compound made of 50% silicone, 30% metal oxide and 20% carbon compounds; no spreader tool is included.

Is the 20g size sufficient for multiple CPU installations or should I buy a larger tube?

The 20g volume provides enough compound for several applications depending on the amount used per CPU.

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