Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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High-conductivity 13.8 W/m-K silicone thermal paste with cleanser and spatula for CPU, GPU and notebook coolers
The NX-8 kit supplies 4 g of grey silicone grease rated at 13.8 W/m-K thermal conductivity. It targets builders who need to fill microscopic gaps between a processor or graphics die and its cooler. The package also includes a cleanser wipe and a plastic spatula for tidy application. Buyers who require a larger volume for multiple builds will find the single syringe limiting.
The compound maintains its rated 13.8 W/m-K conductivity across a wide operating window from -50 to +250 °C. Its specific gravity of 2.8 g/cm³ resists pump-out during long gaming or render sessions so the interface stays stable. The grease does not dry out quickly, preserving low thermal resistance over months of continuous load. Users who expect liquid-metal performance should look elsewhere.
The included spatula spreads the paste evenly without excess that could spill onto surrounding components. A thin, uniform layer improves contact between die and heatsink, helping the cooler run at lower fan speeds. The cleanser removes old residue completely before each re-application. Systems that rely on phase-change pads will not benefit from this paste format.
No published specifications for this item yet.
The 13.8 W/m-K silicone grease fills microscopic gaps between the die and cooler, improving heat transfer so components run cooler and fans can spin more quietly under sustained loads.
You need a clean CPU or GPU heat spreader, a compatible heatsink or water block, and isopropyl alcohol with lint-free wipes to remove old compound before using the included spatula.
The compound remains stable from -50 °C to +250 °C, well above typical legacy CPU temperatures, so it will not dry out or degrade even on older, hotter-running silicon.
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