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Aluminium M.2 SSD heatsink with thermal pads

Ruth's sister

Ruth's sister internal power cable 4.0

SKU CH-RYNC-S1SC2

An aluminum-alloy M.2 SSD heatsink with thermal pads for PCIe 4.0 passive cooling

  • Aluminium alloy construction dissipates heat from M.2 SSDs
  • PCIe 4.0 compatible for high-speed storage devices
  • Includes thermal pads for effective heat transfer
  • Passive cooling design operates without fans or power

M.2 SSD heat sink for PCIe 4.0

This passive cooler uses an aluminium-alloy body and included thermal pads to draw heat away from an M.2 solid-state drive. It fits standard M.2 slots and operates without a fan, making it suitable for compact builds where airflow is limited. Builders who want to keep drive temperatures stable during sustained workloads will find it a straightforward upgrade.

Included thermal pads and mounting hardware

The package supplies pre-cut thermal pads that cover the controller and memory components, eliminating the need to source pads separately. Mounting hardware is also provided so the heat sink can be secured directly to the drive without additional tools. Buyers who need active cooling with a fan or a taller heatsink for multi-drive stacks should look elsewhere.

Highlights

  • Aluminium alloy construction dissipates heat from M.2 SSDs
  • PCIe 4.0 compatible for high-speed storage devices
  • Includes thermal pads for effective heat transfer
  • Passive cooling design operates without fans or power

Specifications

No published specifications for this item yet.

Questions about this item

Will the thermal pads need replacing after a while?

The included thermal pads transfer heat from the SSD to the aluminum alloy heatsink; they should be inspected periodically and replaced if they lose tackiness or compress permanently.

What limits cooling performance during prolonged heavy workloads?

The passive aluminum alloy design relies on case airflow to dissipate heat, so sustained write loads are limited by the chassis ventilation rather than the heatsink itself.

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