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Rectangular grey silicone thermal pad 85 by 45 by 0.5 mm

Ruth's sister

Ruth's sister 14.8W/mK thermal pad 85x45x0.5mm internal power cable

SKU CH-V0D5-Z0GPV

High-conductivity 14.8 W/mK silicone thermal pad sized 85 by 45 by 0.5 mm for CPU, GPU and motherboard cooling

  • High thermal conductivity of 14.8 W/mK for efficient heat transfer
  • Non-electrically conductive silicone prevents short circuits on sensitive components
  • Soft 30–55 Shore C hardness conforms to uneven surfaces
  • Pre-cut 85×45×0.5 mm size fits GPU VRAM and VRM areas
  • Density of 3.1 g/cc ensures consistent performance across the pad

High-conductivity silicone thermal pad

The pad delivers a thermal conductivity of 14.8W/mK and measures 85x45x0.5mm. It is non-electrically conductive, non-corrosive, non-hardening and non-toxic. The material suits PCB surfaces, graphics cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components. Builders needing a thin, high-performance interface for air-cooled radiators can apply it directly.

Single-pad packaging with no adhesive

The package contains one thermal pad only. No adhesive backing, mounting hardware or installation tools are supplied. The silicone remains pliable across a hardness range of 30 to 55 Shore C and a density of 3.1±0.2g/cc. Users must provide any fixing method or additional pads for larger surfaces themselves.

Limited by 0.5mm thickness and manual tolerance

The fixed 0.5mm thickness restricts use to gaps that match this dimension; larger voids cannot be bridged. A 2-3% dimensional variance from manual measurement means the actual size may deviate slightly from 85x45mm. The pad relies on surface contact pressure alone, so uneven mounting surfaces may reduce effective thermal transfer.

Highlights

  • High thermal conductivity of 14.8 W/mK for efficient heat transfer
  • Non-electrically conductive silicone prevents short circuits on sensitive components
  • Soft 30–55 Shore C hardness conforms to uneven surfaces
  • Pre-cut 85×45×0.5 mm size fits GPU VRAM and VRM areas
  • Density of 3.1 g/cc ensures consistent performance across the pad

Specifications

No published specifications for this item yet.

Questions about this item

Does the 14.8 W/mK silicone pad need replacing after a certain period?

The pad is non-hardening and non-corrosive, so it does not degrade or require scheduled replacement under normal use.

What is the first limit reached when the pad runs continuously at full load?

Thermal transfer is capped by the 14.8 W/mK conductivity rating and the fixed 0.5 mm thickness.

Does the pad generate any noise or extra heat during all-day operation?

The passive silicone material produces no noise and adds no heat; it only conducts heat away from the component.

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