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Small white syringe of thermal paste with grey cap

Prolimatech

Prolimatech PRO-PK3-5G thermal paste 5 g

SKU CH-1N9Q-3C0C4 MPN PRO-PK3-5G

High-conductivity nano-aluminium compound fills microscopic gaps for 11.2 W/m°C heat transfer and 0.013 °C-in²/W resistance

  • SpecificationsMaterial Specification: Al 70~88(wt%) ZnO 18~34(wt%) Oil 8~1
  • FeaturesHigh Thermal Conductivity Low Thermal Resistance Long-Term S
  • High thermal conductivity of 11.2 W/m-°C for efficient heat transfer
  • Low thermal impedance of .013 °C-in²/W reduces resistance
  • Electrically non-conductive formula prevents short circuits
  • No burn-in time required for immediate performance
  • Long-term stability with low dry-out maintains effectiveness

5 g nano-aluminium thermal compound

Prolimatech PRO-PK3-5G is a 5 g syringe of nano-aluminium thermal grease designed for CPU and GPU heat-spreaders. The compound uses aluminium and zinc-oxide particles suspended in a synthetic oil base to fill microscopic surface gaps. It targets system builders and upgraders who need reliable heat transfer without electrical conductivity risk.

Non-corrosive paste with 330000 Cps adhesiveness

The material specification lists aluminium at 70 to 88 wt%, zinc oxide at 18 to 34 wt%, oil at 8 to 12 wt% and antioxidant at 0.5 to 2 wt%. This blend yields a specific gravity of 2.7 g/cm³ and a thick, stable consistency that resists pump-out and dry-out over long periods. The paste is electrically non-conductive and non-corrosive, so accidental contact with surrounding components will not cause shorts or degradation. No burn-in time is required before the thermal path reaches full performance.

Check syringe volume and application method before

The package contains 5 g of compound, which covers multiple standard desktop sockets but may be limited for large server dies or repeated reapplications. Verify that your cooler mounting pressure is sufficient to spread the high-viscosity paste evenly across the heat-spreader. Ensure the surfaces are clean and free of old compound residue to achieve the rated 11.2 W/m-°C conductivity and 0.013 °C-in²/W impedance.

Highlights

  • High thermal conductivity of 11.2 W/m-°C for efficient heat transfer
  • Low thermal impedance of .013 °C-in²/W reduces resistance
  • Electrically non-conductive formula prevents short circuits
  • No burn-in time required for immediate performance
  • Long-term stability with low dry-out maintains effectiveness

Specifications

BrandProlimatech
ModelPRO-PK3-5G
SpecificationsMaterial Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.7g/cm3
FeaturesHigh Thermal Conductivity
Low Thermal Resistance
Long-Term Stability
Low dry-out
No "burn-in" time required
Non-Corrosive
Electrically Non-Conductive
Shipping weight0.01 kg
Package size173 × 25 × 15 mm

Questions about this item

What thermal conductivity does the PK-3 compound provide at 11.2 W/m-°C?

The PK-3 compound delivers 11.2 W/m-°C thermal conductivity with 0.013 °C-in²/W impedance, using nano aluminium particles (70~88 wt%) and zinc oxide (18~34 wt%) to fill microscopic gaps between heatsink and processor for efficient heat transfer.

What physical form and volume does the 5 g syringe supply for application?

The 5 g syringe contains a paste with 2.7 g/cm³ specific gravity and 330000 Cps adhesiveness, letting you dispense a thin, even layer directly onto the CPU heat spreader without a separate spreader tool.

How is PK-3 applied and what common step should be avoided?

Clean both surfaces, apply a small pea-sized dot or thin line, then mount the cooler — the compound is electrically non-conductive, non-corrosive, requires no burn-in time, and spreads under mounting pressure; do not pre-spread with a card or finger.

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