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Small white syringe containing 1.5 g grey thermal compound

Prolimatech

Prolimatech PRO-PK3-1.5G thermal paste 1.5g

SKU CH-RREM-JD0GD MPN PRO-PK3-1.5G

Nano-aluminium thermal compound with 11.2 W/m-°C conductivity and 0.013 °C-in²/W resistance, electrically non-conductive and ready to use without burn-in

  • SpecificationsMaterial Specification: Al 70~88(wt%) ZnO 18~34(wt%) Oil 8~1
  • FeaturesHigh Thermal Conductivity Low Thermal Resistance Long-Term S
  • High thermal conductivity rated at 11.2 W/m-°C for efficient heat transfer
  • Low thermal resistance of 0.013 °C-in²/W minimises temperature drop
  • Electrically non-conductive formula prevents short circuits on exposed traces
  • No burn-in time required so performance is immediate after application
  • Long-term stability with low dry-out keeps paste effective for years

High-Grade Thermal Compound for CPU and GPU

Prolimatech PRO-PK3-1.5G is a nano-aluminium thermal paste designed to fill microscopic gaps between a processor and its cooler. The 1.5 gram syringe suits builders assembling a new system or refreshing an existing desktop or laptop. Its electrically non-conductive formula eliminates the risk of short circuits if excess material spreads beyond the die.

Sustained Load Behaviour with Low Dry-Out

The compound maintains long-term stability under continuous thermal cycling thanks to a low dry-out characteristic and antioxidant content of 0.5~2 wt%. Thermal conductivity of 11.2 W/m-? and impedance of .013 ?-in²/W remain consistent without a burn-in period. Adhesiveness of 330000 Cps keeps the layer in place during extended high-temperature operation.

Compatibility Checks Before Ordering

Verify that your cooler mounting pressure can spread a thin, even layer across the specific die size you are cooling. The 1.5 g volume covers multiple standard desktop CPUs but may be insufficient for large server processors or multiple graphics cards. Ensure the surface is clean of old paste residue before application.

Highlights

  • High thermal conductivity rated at 11.2 W/m-°C for efficient heat transfer
  • Low thermal resistance of 0.013 °C-in²/W minimises temperature drop
  • Electrically non-conductive formula prevents short circuits on exposed traces
  • No burn-in time required so performance is immediate after application
  • Long-term stability with low dry-out keeps paste effective for years

Specifications

BrandProlimatech
ModelPRO-PK3-1.5G
SpecificationsMaterial Specification:
Al 70~88(wt%)
ZnO 18~34(wt%)
Oil 8~12(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 330000Cps
Thermal Conductivity: 11.2 W/m - Degree C
Thermal Impedance (Resistance): 0.013 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread card.
Specific Gravity: 2.7g/cm3
FeaturesHigh Thermal Conductivity
Low Thermal Resistance
Long-Term Stability
Low dry-out
No "burn-in" time required
Non-Corrosive
Electrically Non-Conductive
Shipping weight0.01 kg
Package size104 × 20 × 14 mm

Questions about this item

Does the PK-3 compound dry out or lose performance after months of continuous operation?

The paste is formulated for long-term stability and low dry-out, so it maintains its thermal conductivity of 11.2 W/m-? and impedance of .013 ?-in²/W over extended use.

What tools or materials do I need before applying this 1.5 g syringe?

You need isopropyl alcohol and a lint-free cloth to clean the CPU and cooler surfaces, plus a spreader or gloved finger to apply the nano-aluminium paste evenly.

Will the electrically non-conductive formula safe-guard an older motherboard if paste bridges nearby pins?

Yes, the compound is electrically non-conductive and non-corrosive, so accidental contact with socket pins or legacy components will not cause short circuits.

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