Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Phobya
High-performance thermal compound with 8.5W/mK conductivity and 85000cps viscosity for CPU, GPU, and chipset cooling in a 3.5g syringe
Phobya HeGrease Extreme is a thermal interface material rated at 8.5 W/mK for CPU, GPU and chipset applications. The 3.5 g syringe targets enthusiasts who want measurable temperature drops without changing hardware. Model 31078 delivers the conductivity figure usually reserved for premium pastes.
The compound ships in a syringe with a screw-on cap that preserves unused material between applications. Its 85000 cps viscosity lets you spread a thin, even layer that minimises the gap between die and cooler. Electrically non-conductive formulation removes the risk of short circuits if paste bridges nearby components.
Replacing stock or generic grease with this 8.5 W/mK compound can lower peak temperatures on existing coolers. The gain is most noticeable when the original paste has dried out or was applied too thickly. Users whose thermal solution already performs within specification will see smaller returns.
| Brand | Phobya |
|---|---|
| Model | 31078 |
| Part Number | 31078 |
| Specifications | 3.5g |
| Features | Phobya's HeGrease Extreme, designed to gain the last bit of cooling performance in the high-end sector! This thermal compound is of course not only well-suited for the high-end sector, the normal user can also profit from this product. It allows better cooling performance for an existing system with little effort. |
The 8.5W/mK thermal conductivity enables efficient heat transfer between the CPU, GPU, or chipset and the cooler, helping to lower operating temperatures in high-performance systems.
The syringe holds 3.5g of compound; the screw-on cap seals the unused portion to prevent drying and keep it fresh for future applications.
Apply a thin, even layer directly onto the heat source using the syringe tip; the 85000cps viscosity allows smooth spreading without excess, ensuring minimal gap between die and cooler.
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