Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Phobya
A 100 by 100 millimetre thermal pad 1.0 millimetre thick with 1.5 W/mK conductivity, flexible and slightly sticky for VRAM, VRM or chipset cooling
This Phobya thermal pad is a single 100 x 100 x 1.0 mm sheet rated at 1.5 W/mK. It is designed to fill gaps between a cooler and components such as VRAM or VRM modules, evening out microscopic scratches and larger height differences. The soft, flexible material conforms well even under low mounting pressure. A protective foil covers the slightly tacky surfaces and must be removed before use.
Builders who need a thin, compliant interface for memory chips, voltage regulators or similar small areas will find this pad easy to trim and install. It is not aimed at users who require higher thermal conductivity or a different thickness for their specific cooler design. Anyone needing a pre-cut shape or a multi-pack for repeated maintenance should consider other options.
The 1.5 W/mK rating is the single figure that determines whether this pad meets the thermal demand of the target component. If the application calls for a higher conductivity value, this model will not suffice regardless of its softness or dimensions.
| Brand | Phobya |
|---|---|
| Model | 17045 |
| Part Number | 17045 |
| Features | These thermal pads are perfectly suited to equalize height differences and uneven spots on coolers and cooled elements. The very flexible structure and low hardness allow great adaptivity to the cooling surface even at low contact pressures. The thermal pad equalizes the effect of irregularities from microscopic scale to visible scratches etc. |
The pad is a passive thermal interface with 1.5 W/m·K conductivity; it adds no active heat or noise and simply conducts heat away from the component.
You need the graphics card or motherboard with accessible VRAM or VRM surfaces, a cooler or heatsink to mate with the pad, and basic tools to remove the protective foil and trim the sheet if required.
The pad’s low hardness and flexible structure let it conform at low contact pressures, so it adapts to the existing mounting force of legacy coolers without needing extra pressure.
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