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Two thin grey squares thirty one by fifty millimetres point two thick on a backing sheet

PANO-MOUNTS

PANO-MOUNTS PPTM7950 Phase Change Thermal Pad 31x50x0.2mm 2-Pack 8.5W/mK

SKU CH-HT6E-H6EV6

Phase-change pad at 8.5 W/mK with 0.04 °Ccm²/W resistance fits 31 × 50 × 0.2 mm surfaces and installs without cure time

  • Thermal Conductivity8.5 W/mK

Option 31×50×0.2mm

  • Phase-change material eliminates paste mess and curing time
  • 5 W/mK conductivity moves heat efficiently from CPU, GPU or SSD
  • Ultra-low 0.04 °Ccm²/W resistance keeps components cooler under load
  • 31 × 50 × 0.2 mm pads with micro-adhesive cut to fit exact die size
  • Two pads included for multiple devices or spare installation

PANO-MOUNTS PPTM7950 Phase Change Thermal Pad

The PANO-MOUNTS PPTM7950 is a phase change thermal pad measuring 31x50x0.2mm with 8.5 W/mK thermal conductivity. It comes in a two-pack and is designed for CPU, GPU and SSD core heat dissipation. The material replaces traditional thermal paste and requires no curing time after installation.

Phase change material

The pad uses a phase change compound that softens under heat to fill microscopic gaps between the die and cooler. It offers ultra-low thermal resistance of 0.04°Ccm²/W for efficient heat transfer. The format eliminates the mess and uneven spread associated with liquid pastes. It is not intended for graphics memory or power delivery components.

31x50mm sheets with double-sided adhesive

Each sheet measures 31 by 50 millimetres and includes a double-sided micro adhesive layer that holds position during assembly. The pads can be cut to shape for smaller dies or laptops such as the Steam Deck. Two pads provide enough material for multiple applications or a spare. The 0.2mm thickness suits tight clearances in compact devices.

Highlights

  • Phase-change material eliminates paste mess and curing time
  • 5 W/mK conductivity moves heat efficiently from CPU, GPU or SSD
  • Ultra-low 0.04 °Ccm²/W resistance keeps components cooler under load
  • 31 × 50 × 0.2 mm pads with micro-adhesive cut to fit exact die size
  • Two pads included for multiple devices or spare installation

Specifications

Thermal Conductivity8.5 W/mK

Other versions of this model

2 more in the same range

Same family, different memory, cooler or clock — compare before you commit.

Questions about this item

How do I decide between the two pads in the 2-pack?

Both pads are identical 31 x 50 x 0.2 mm sheets with 8.5 W/mK conductivity; use one per component or cut a single pad to fit smaller dies.

What does the 8.5 W/mK rating deliver once the pad is installed?

At operating temperature the material changes phase, filling microscopic gaps and achieving 0.04 °Ccm²/W resistance for consistent CPU, GPU or SSD heat transfer.

Does the pad rely on a specific mounting standard or interface?

No proprietary interface is required; the double-sided micro-adhesive layer lets you place the custom-cut pad directly on any compatible heat-spreader surface.

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