Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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ORVIX
A 100 x 100 x .5 mm thermal pad that is particularly soft to bridge gaps and minimise thermal resistance on CPUs, GPUs and RAM
The ORVIX TP-3 is a 100 x 100 mm thermal pad designed for precise heat transfer across uneven component surfaces. Its extremely low hardness allows it to conform tightly to microscopic gaps between chips and heatsinks. Builders working on GPUs, laptops or consoles use it where standard paste cannot bridge height differences. The silicone-based compound contains no metal particles, ensuring electrically safe handling.
This .5 mm thickness minimises thermal resistance compared to bulkier gap fillers that separate contact surfaces. The upgrade is worthwhile when factory pads are too stiff to mate properly with memory modules or voltage regulators. Compression properties let it maintain contact pressure without pumping out over thermal cycles. Users replacing dried-out putty on legacy boards gain consistent coverage without electrical risk.
The sheet can be cut to exact shapes for RAM ICs, chipset blocks or discrete GPU components. Its vibration-damping character helps stabilise tall heatsinks mounted on vertical cards. Electrically insulating properties eliminate the need for Kapton tape around exposed PCB traces. Installers should consult the manual because the ultra-soft texture demands careful placement to avoid tearing.
| Brand | ORVIX |
|---|
This pad measures exactly 100 x 100 mm, so it covers that footprint without trimming; you can still cut it smaller for individual chips.
The pad is extremely soft, so it deforms easily; handle it gently, avoid stretching, and place it straight down to prevent air gaps.
Replace it whenever you disassemble the heatsink or if temperatures rise after prolonged use, as the silicone material can dry out or lose compliance over time.
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