Noctua NT-H1 3.5g SW Edition thermal paste

Premium thermal compound for CPUs and GPUs

Noctua NT-H1 3.5g SW Edition is a hybrid thermal paste designed for optimal heat transfer between processors and heatsinks. The package includes a spreading spatula and three cleaning wipes so no separate cleaner is required. It suits air coolers, liquid coolers and all-in-one units across desktop and console platforms. Builders seeking a proven paste with long-term stability will find it fits mainstream and enthusiast systems alike.

Practical limits of the included accessories

The 3.5g syringe yields roughly 3 to 20 applications depending on the processor size, with larger sockets such as TR4 using more paste per install. Three NA-CW1 wipes cover a single cleaning cycle per application, so additional wipes are needed for repeated rework. The spatula aids manual spreading but cannot replace a dedicated stencil for precise patterns. Storage life is rated up to three years and operational life up to five years on the die.

Compatibility checks before ordering

Verify the processor package dimensions to estimate how many applications the 3.5g tube will provide for your specific socket. Confirm that the cooler mounting pressure is compatible with non-conductive hybrid compounds. Ensure the cleaning wipes are suitable for the heatsink base material you intend to use. Buyers who need larger volumes for multiple builds or professional rework stations should look for higher-capacity packaging.