Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Permanent two-part ceramic epoxy bonds heatsinks to CPUs, GPUs and other chips where clips cannot fit, using aluminum oxide and boron nitride fillers for electrically insulating thermal transfer
Arctic Silver Ceramic Thermal Epoxy is a two-part epoxy adhesive designed to permanently bond heatsinks to CPUs, GPUs, RAM, VRMs, and other integrated circuits where mechanical mounting is not possible. The electrically insulating formula uses aluminum oxide and boron nitride ceramic fillers to provide efficient heat transfer without risk of short circuits on exposed PCBs. It creates a durable, high-strength bond once fully cured.
The 6-gram set supplies Part A resin and Part B hardener in separate 3 g Luer slip syringes for precise, controlled dispensing. The simple equal-volume mixing ratio eliminates guesswork and allows small batches to be prepared as needed. This packaging reduces waste and ensures fresh adhesive for each application, which is critical because the compound cannot be reworked after curing.
The 6 g combined volume covers several typical chip-scale heatsinks such as VRM coolers, RAM sinks, or GPU VRAM blocks. It is not suited for large CPU cold plates or repeated disassembly scenarios because the bond is permanent and the total quantity is limited. Builders needing removable thermal interface material or larger coverage areas should select a standard thermal paste instead.
| Brand | Arctic Silver |
|---|---|
| Model | ACE-6G |
| Part Number | ACE-6G |
| Specifications | 2 x 3g syringes |
| Features | A permanent, electrically insulating two-part thermal adhesive that securely bonds heatsinks while delivering efficient heat transfer for CPUs, GPUs, and other components. |
No, the two-part epoxy forms a permanent bond after curing. It is designed for situations where mechanical fasteners cannot be used, so the adhesive itself becomes the structural mount and does not require replacement.
The cured epoxy maintains its bond indefinitely under normal operating temperatures. The aluminum oxide and boron nitride fillers remain stable, so thermal cycling does not degrade the adhesive layer.
The compound is electrically insulating and thermally conductive; it transfers heat from the component to the heatsink without generating any heat itself. Power draw and noise are unaffected by the adhesive layer.
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