Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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ModMyMods
Adhesive thermal pad measuring 25mm square by 6mm thick with 4.0 W/m-K conductivity to transfer motherboard heat to the case
This blue adhesive thermal pad measures 25 mm by 25 mm by 6 mm and conducts heat at 4.0 W/m-K. It is designed to transfer thermal energy from motherboard components directly to the computer case chassis. The self-adhesive backing simplifies installation on flat surfaces without separate retention hardware.
The pad relies on direct contact between the motherboard hotspot and the metal case panel to function. Thermal resistance rises quickly if the mating surfaces are uneven, painted or separated by an air gap. It cannot bridge large height differences or replace a mounted heatsink with active airflow.
The 25 mm square footprint suits individual voltage-regulator modules, chipset packages or similar discrete components. A single pad handles moderate heat loads from one component but lacks the area for high-wattage devices or multiple hotspots. Builders needing broader coverage must apply several pads side by side.
| Brand | Generic |
|---|---|
| Model | MOD-0044 |
| Part Number | MOD-0044 |
| Features | Adhesive Thermal Pad for Motherboard (Transfer Heat from Motherboard to Computer Case) |
The pad measures 25 mm by 25 mm by 6 mm, so choose it when your component contact area matches those dimensions.
It indicates a thermal conductivity of 4.0 W/m-K, allowing heat to move from the motherboard to the case at that rate.
The adhesive bonds the 25 mm pad directly to the surface, maintaining the stated 4.0 W/m-K path without extra mounting hardware.
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