Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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Manw
A 100 x 100 mm, 1.5 mm thick silicone thermal pad that compresses easily to fill gaps on RAM, chipsets and GPUs while remaining electrically insulating
This 100 x 100 x 1.5 mm silicone-based pad targets builders who need a soft, electrically insulating gap filler for RAM, chipset, ICs, or graphics-card memory. It bridges height differences between closely spaced chips where stiffer pads leave air pockets. The material contains no metal particles, so accidental contact with live traces will not cause shorts.
The package includes a user manual that addresses the demanding installation caused by the pad's extremely low hardness. Because the material is mouldable and vibration-damping, it can be trimmed with scissors to fit irregular component layouts in laptops, consoles, or desktop graphics cards without specialised tools.
At 1.5 mm thickness the pad minimises thermal resistance while its high compressibility conforms to uneven surfaces across a 100 x 100 mm sheet. It handles typical memory-module and chipset heat loads comfortably, but the single-piece format and fixed thickness limit coverage for larger VRM arrays or multi-die packages requiring thicker shims.
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The pad is designed to maintain its thermal performance through compression; no scheduled replacement is required unless physical damage occurs.
Thermal resistance rises if the pad is stretched beyond its 1.5 mm design thickness, so keeping the original gap size is the practical limit.
The silicone-based pad is passive and electrically insulating, so it adds no noise, no active heat and draws zero power.
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