Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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A 2 g syringe of non-conductive thermal compound rated at 12.8 W/mk for CPUs and GPUs, stable from -150 °C to +250 °C and supplied with a spatula for easy application
This thermal compound comes in a two-gram syringe rated at 12.8 W/mK thermal conductivity. It targets PC builders and laptop owners who need reliable heat transfer between a CPU or GPU die and a cooler base. The non-conductive, metal-free formula makes it safe for direct-die and exposed-die applications without risk of shorting surrounding components.
The needle-style nozzle and supplied spatula let you deposit small dots or a thin spread with minimal mess. No curing time is required, so the cooler can be seated immediately after application. The paste remains stable across a -150 °C to +250 °C operating range and resists drying out, so re-application intervals are extended in desktop, laptop and chipset installations.
Swapping out aged or basic silicone grease for this higher-conductivity compound can lower junction temperatures when the original material has pumped out or degraded. The upgrade is most worthwhile when the current paste is several years old, has become crusty, or was a generic pad with significantly lower thermal conductivity. Builders already using a premium 12 W/mK or higher paste will see minimal further gain.
| Volume / Net Weight | 2g |
|---|---|
| Thermal Conductivity | 12.8W/mk |
| Long Term Operating Temperature | -150/ +250 C |
The paste is rated for continuous operation from -150 °C to +250 °C, so the thermal conductivity stays stable even under sustained heavy load.
Low volatility and a needle-type syringe with included spatula keep the compound from drying out or hardening, so application remains consistent over time.
The compound contains no metal particles and is non-conductive, so it works with any standard CPU or GPU cooler and requires only common isopropyl alcohol for cleanup.
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