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JunPus International Co., Ltd.

JunPus JP-DX1 Nano Diamond Thermal Paste 1KG

SKU CH-2P3Y-MMRMZ

Nano-diamond thermal compound with 16 W/m-K conductivity, -40 °C to 240 °C operating range and 1 kg volume for high-performance cooling

  • High thermal conductivity of 16 W/m-K for efficient heat transfer
  • Low thermal impedance of 0.05 cm²/W reduces resistance between surfaces
  • Stable performance from -40 °C to 240 °C recommended range
  • Non-curing formula stays workable up to 4 years on the CPU
  • Includes razor blade for easy, precise application

Professional-grade thermal compound for system

JunPus JP-DX1 Nano Diamond Thermal Paste is a high-performance thermal interface material designed for PC enthusiasts and technicians who demand reliable heat transfer. The grey, non-curing grease uses nano-diamond particles to achieve a thermal conductivity of 16 W/m-K. It remains stable across a peak operating range of -50°C to +250°C.

Thermal conductivity of 16 W/m-K defines cooling

This single figure determines whether the paste can handle your specific heat load, from mainstream CPUs to heavily overclocked processors. With a low thermal impedance of 0.05 cm²/W and specific gravity of 2.7 g/cm³, the compound fills microscopic gaps efficiently. It is not suited for buyers who require electrically conductive paste or sub-ambient cooling setups.

Included razor blade enables precise.

The bundled tool lets you spread a thin, even layer directly from the 1 kg container without separate purchases. Non-corrosive, non-toxic and non-flammable properties mean safe handling on all common metal surfaces. The paste resists drying for up to four years on the CPU and stores for three years before use.

Highlights

  • High thermal conductivity of 16 W/m-K for efficient heat transfer
  • Low thermal impedance of 0.05 cm²/W reduces resistance between surfaces
  • Stable performance from -40 °C to 240 °C recommended range
  • Non-curing formula stays workable up to 4 years on the CPU
  • Includes razor blade for easy, precise application

Specifications

BrandJunpus
SeriesJP-DX1
ModelJP-DX1

Questions about this item

What does 16 W/m·K thermal conductivity mean for actual CPU temperatures?

It indicates very high heat-transfer capability; in practice it lowers the thermal resistance between die and cooler, helping keep peak core temperatures closer to the coolant temperature under heavy load.

How does the 0.05 cm²/W thermal impedance limit real-world performance?

That figure represents the resistance of a standard-thickness layer; thinner application reduces the absolute resistance further, but the paste itself will not be the bottleneck in most desktop cooling setups.

What does the 1 kg syringe need to fit or mount on a typical build?

The package includes a razor-blade spreader; you only need a clean, flat mating surface on the CPU heat-spreader and cooler base — no special brackets or tools are required.

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