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Intel Xeon E5-2620 v2 processor, silver metal heat spreader with gold contacts, rectangular LGA2011 form factor

Intel

Intel Xeon E5-2620 v2 SR1AN 6-Core 2.10GHz 15MB 7.2GT/s FCLGA2011 80W CPU accessory

SKU CH-87HK-MWRN1

Six-core Xeon processor running at 2.1 GHz with 15 MB cache and 80 W TDP for FCLGA2011 servers

  • Six cores handle parallel workloads efficiently
  • 10 GHz base frequency delivers steady compute performance
  • 15 MB L3 cache reduces data-access latency
  • 2 GT/s QPI speed enables fast inter-processor communication
  • 80 W TDP balances power draw with thermal headroom

Intel Xeon E5-2620 v2 6-Core Processor

This Intel Xeon E5-2620 v2 processor delivers six cores at 2.10 GHz with 15 MB L3 cache. It uses the FCLGA2011 socket and operates within an 80 W thermal envelope. The part suits servers or workstations needing reliable multi-threaded throughput.

Upgrade from dual-core or quad-core Xeon E5 v1

Moving from an earlier dual-core or quad-core Xeon E5 v1 chip adds two extra cores and a 22 nm process shrink. The jump is worthwhile when your workloads scale across six threads and the platform already supports the v2 stepping.

Verify FCLGA2011 socket and v2 BIOS support

Confirm the motherboard uses an FCLGA2011 socket and has a BIOS revision that recognises the v2 series. Ensure the cooler is rated for an 80 W TDP and that the power delivery can sustain the rated draw.

Highlights

  • Six cores handle parallel workloads efficiently
  • 10 GHz base frequency delivers steady compute performance
  • 15 MB L3 cache reduces data-access latency
  • 2 GT/s QPI speed enables fast inter-processor communication
  • 80 W TDP balances power draw with thermal headroom

Specifications

BrandIntel

Questions about this item

Will the FCLGA2011 socket fit my existing LGA2011 cooler mounting holes?

The processor uses the FCLGA2011 socket which shares the same 80 mm mounting pattern as standard LGA2011 coolers.

Does the 22 nm die require any special thermal-paste technique during installation?

Apply a pea-sized dot of paste; the integrated heat spreader is flat so even pressure from the cooler clamp spreads it correctly.

When should I expect to replace the thermal interface material under the heat spreader?

The soldered 22 nm die does not use replaceable paste; only the cooler-to-IHS layer needs renewal every few years.

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