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Two rectangular grey thermal pads on a light background

GELID SOLUTIONS

GELID SOLUTIONS GP-Ultimate 15W/mK Thermal Pad 90x50x1.5mm 2pcs

SKU CH-0XBC-RV3BV

High-conductivity 15 W/mK thermal pads, 90×50×1.5 mm, non-conductive and non-curing, two pieces for GPU and PCB gap filling

  • 15 W/mK conductivity moves heat fast from hot components
  • Non-conductive and non-corrosive so it will not short circuits
  • Soft pad fills uneven gaps on MOSFETs and memory chips
  • Ready-cut 90×50 mm sheets fit large GPU and board surfaces
  • Stable from –60 °C to 220 °C for extreme operating ranges

High-conductivity thermal pad for uneven surfaces

The GELID SOLUTIONS GP-Ultimate is a 15 W/mK thermal pad sized at 90 by 50 millimetres and 1.5 millimetres thick, supplied as a pair of pieces. It is engineered to bridge height differences on dense printed circuit boards such as graphics cards, motherboards and add-on cards where traditional paste cannot maintain contact.

Suited for component-level gap filling on GPUs

This pad serves builders and technicians who need a non-electrically conductive, non-corrosive interface for power MOSFETs, chipsets, memory ICs and other SMD components with uneven topography. It is not intended for users who require a spreadable compound for large, flat CPU integrated heat spreaders or for applications demanding a thickness outside the 0.5 to 3.0 millimetre range.

Fits around tall components

The soft, non-curing material conforms to stepped PCB layouts without hardening over its operating span of minus 60 to 220 degrees Celsius. It eliminates pump-out and dry-out issues common with grease, allowing a maintenance-free thermal path on laptop modules, game consoles and microcontroller boards where disassembly is difficult.

Highlights

  • 15 W/mK conductivity moves heat fast from hot components
  • Non-conductive and non-corrosive so it will not short circuits
  • Soft pad fills uneven gaps on MOSFETs and memory chips
  • Ready-cut 90×50 mm sheets fit large GPU and board surfaces
  • Stable from –60 °C to 220 °C for extreme operating ranges

Specifications

No published specifications for this item yet.

Questions about this item

What size heatsink or component surface do the 90x50mm pads cover?

Each pad measures 90x50mm, so two pads cover larger PCB areas such as GPU memory arrays, VRM zones, or laptop chipsets with a single piece per zone.

Will the 1.5mm thickness bridge the gap on my existing GPU backplate or motherboard heatsink?

At 1.5mm thick the pad fills typical gaps between chips and heatsinks on graphics cards, motherboards, and consoles; other thicknesses of .5, 1.0, 2.0, and 3.0mm are available if the stack height differs.

How can I verify the pad is conducting heat properly after installation?

The pad is rated at 15W/mK thermal conductivity and operates from -60°C to 220°C; reduced component temperatures under load confirm it is working as intended.

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