Black Box C6APC28-WH-15 network ethernet cable 28 AWG 14.76 ft 500 MHz White
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GELID SOLUTIONS
High-conductivity 15W/mK thermal pad fills gaps on GPUs, motherboards and SMD components, non-conductive and stable from -60°C to 220°C
The GELID SOLUTIONS GP-Ultimate thermal pad delivers 15W/mK conductivity to bridge gaps between heatsinks and components with varying heights. It targets builders servicing GPU cards, motherboards, laptops and consoles where standard paste cannot maintain contact across stepped PCB layouts. The non-electrically conductive, non-corrosive material remains pliable from -60°C to 220°C without curing or hardening over time.
Under continuous operation the pad maintains its thermal path without pumping out, drying or becoming brittle, thanks to a multilayer matrix that resists phase change. Its non-curing formulation keeps pressure distribution consistent across MOSFETs, chipsets and memory ICs during prolonged high-temperature cycles. The 1.0mm thickness in this pack suits components with moderate stack height while the 90x50mm sheet covers large VRM arrays or memory banks in a single piece.
The 15W/mK figure is the single metric that determines whether this pad meets the thermal resistance budget for a given heatsink-to-die gap. Buyers needing lower conductivity for thinner bond lines or higher conductivity for direct-die replacement should select a different grade. This two-piece pack provides 90x50mm pads at 1.0mm thickness; other thicknesses from 0.5mm to 3.0mm exist but are not included here.
No published specifications for this item yet.
The pad is rated at 15 W/mK and operates continuously from -60 °C up to 220 °C, so it maintains steady heat transfer during extended loads.
You need a heatsink or cooler mounting surface that matches the 90 mm by 50 mm footprint and a 1.0 mm gap between the die and the heatsink.
The 1.0 mm pad is twice as thick as a .5 mm pad; it will only seat correctly if the original design allows a 1.0 mm stack height.
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