GELID SOLUTIONS GP-Extreme Thermal Pad 120x120x1.5mm 12.0 W/mK

High-conductivity thermal pad for uneven surfaces

The GELID SOLUTIONS GP-Extreme is a 120 x 120 mm thermal pad with a 1.5 mm thickness. It provides a 12.0 W/mK thermal conductivity rating for transferring heat from components to heatsinks. The pad is designed for PCBs with varying heights such as memory ICs, MOSFETs and other SMD parts. Its soft construction allows it to fill gaps effectively across uneven surfaces.

Single 120 mm sheet with 1.5 mm thickness

One sheet covers a 120 x 120 mm area, offering enough material for multiple small components or a single larger die. The 1.5 mm thickness provides compliance for stacked components or taller packages. Thermal resistance increases with thickness, so this pad suits gaps close to its nominal height. Thinner or thicker gaps will require a different pad specification.

Replaces reusable pastes and lower-conductivity pads

This pad upgrades from standard thermal paste when rework is infrequent and a permanent interface is acceptable. It replaces lower-conductivity pads that cannot bridge 1.5 mm gaps or conform to height variations. The jump is worth it when components sit at different heights or when a mess-free, pre-cut interface speeds up assembly. It is not for users who need a reusable interface or a thickness outside 1.5 mm.