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Light grey thermal pad sheet 120 by 120 millimetres 3.0 millimetres thick

GELID SOLUTIONS

GELID SOLUTIONS GP-Extreme 12W Thermal Pad 120x120x3.0mm

SKU CH-J85E-F303V

A 12 W/m·K thermal pad measuring 120 × 120 × 3.0 mm for RAM, VRM and M.2 SSD cooling

  • Ultimate 12 W/m·K conductivity transfers heat efficiently from uneven surfaces
  • 120 × 120 × 3.0 mm sheet fits RAM, VRM and M.2 components
  • Soft, non-curing material fills gaps without hardening over time
  • Electrically non-conductive pad prevents short circuits on dense PCBs
  • Non-toxic, non-corrosive formula is safe for long-term system use

What this pad is and who needs it

The GP-Extreme is a 120×120 mm thermal pad rated at 12 W/mK. It ships new in a 3.0 mm thickness and is non-electrically conductive, non-corrosive, non-curing and non-toxic. The material targets RAM modules, VRM areas and M.2 type SSDs where height differences or uneven surfaces make paste impractical. Builders who want a single sheet they can cut to fit multiple small components will find it convenient.

Behaviour under sustained load

The pad relies on its softness to maintain full contact across uneven PCB topography during long sessions. Because it does not cure or dry out, the thermal interface remains stable after repeated heat cycles. The 12 W/mK conductivity figure represents steady-state heat transfer rather than a short-burst peak, so temperatures stay consistent during extended gaming or rendering workloads. No electrical conductivity means there is no risk of shorting adjacent SMD parts if the pad shifts slightly.

What it replaces and when the jump matters

The pad replaces thermal paste or lower-conductivity pads on memory ICs, MOSFETs, micro-controllers and analog ICs where gaps exceed what paste can bridge. The upgrade is worthwhile when component heights vary across a board or when a reusable, non-messy interface is preferred for future maintenance. It is not suited for buyers who need a liquid metal compound for direct-die CPU applications or who require a thinner sheet for extremely tight clearances.

Highlights

  • Ultimate 12 W/m·K conductivity transfers heat efficiently from uneven surfaces
  • 120 × 120 × 3.0 mm sheet fits RAM, VRM and M.2 components
  • Soft, non-curing material fills gaps without hardening over time
  • Electrically non-conductive pad prevents short circuits on dense PCBs
  • Non-toxic, non-corrosive formula is safe for long-term system use

Specifications

No published specifications for this item yet.

Questions about this item

Does the 12 W/mK thermal pad stay cool and silent during continuous operation?

The pad itself has no moving parts and generates no noise; it simply conducts heat away from components such as VRMs, memory ICs or M.2 SSDs at a rated 12 W/mK.

What else must I already own for this 120×120 mm, 3.0 mm pad to work?

You need a heatsink or metal surface to press against the pad, plus the target components — such as RAM modules, MOSFETs or an M.2 drive — that have height differences or uneven surfaces.

Will this 3.0 mm thick pad work alongside older graphics cards or motherboards I keep?

Yes, the soft 120×120 mm sheet conforms to uneven PCB topographies on legacy boards, filling gaps around older memory chips, analog ICs or MOSFETs without curing or corroding.

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