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Square grey thermal pad sheet 120 by 120 millimetres and 2.5 millimetres thick

GELID SOLUTIONS

GELID SOLUTIONS GP-Extreme 12W Thermal Pad 120x120x2.5mm

SKU CH-7HBF-4TDW4

12 W/m·K thermal pad in 120×120×2.5 mm sheet for memory, VRM and M.2 SSD cooling

  • 12 W/m·K thermal conductivity moves heat fast
  • Soft 2.5 mm thickness fills uneven PCB gaps
  • Non-conductive material prevents short circuits on components
  • Non-corrosive, non-curing formula stays reliable over time
  • Pre-cut 120×120 mm sheet simplifies installation on RAM, VRM, M.2 SSD

Ultimate Heat Conductivity

The GELID SOLUTIONS GP-Extreme is a 12 W/mK thermal pad measuring 120×120×2.5 mm. It is engineered to bridge uneven surfaces and height differences on PCBs. The soft, non-curing material conforms to memory ICs, MOSFETs, VRM components and M.2 SSDs. It provides a reliable thermal interface for demanding cooling scenarios.

Ideal for gap-filling on mixed-height PCBs

Builders who need to cool VRM arrays, memory modules or M.2 drives with a single sheet will benefit from the high conductivity and easy application. The pad is non-electrically conductive, non-corrosive and non-toxic, making it safe for direct die contact. Buyers who require a liquid metal or paste for direct CPU/GPU die application should consider alternative products.

Handles high-density component clusters

The 120×120 mm sheet offers enough area for multiple VRM phases, RAM chips or several M.2 drives at once. Its 12 W/mK rating moves heat efficiently from dense SMD layouts into heatsinks. Extremely thin gaps below 2.5 mm or applications needing a spreadable compound will exceed this pad's physical limits.

Highlights

  • 12 W/m·K thermal conductivity moves heat fast
  • Soft 2.5 mm thickness fills uneven PCB gaps
  • Non-conductive material prevents short circuits on components
  • Non-corrosive, non-curing formula stays reliable over time
  • Pre-cut 120×120 mm sheet simplifies installation on RAM, VRM, M.2 SSD

Specifications

No published specifications for this item yet.

Questions about this item

What component spacing does the 2.5 mm thickness of this pad suit?

The 2.5 mm pad bridges larger gaps between a heatsink and taller components such as VRM modules or memory ICs on a graphics card or motherboard.

Can the GP-Extreme 12W pad be reused if I swap an older heatsink onto a new board?

Because the material is non-curing it stays soft and can be lifted and repositioned, but a fresh piece is recommended for optimal contact.

How do I verify the 12 W/mK conductivity is effective after installation?

Monitor component temperatures under load; a noticeable drop compared with the previous thermal interface indicates the pad is conducting heat as intended.

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