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Square grey thermal pad 120 by 120 mm 2.0 mm thick

GELID SOLUTIONS

GELID SOLUTIONS GP-Extreme 12W Thermal Pad 120x120x2.0mm

SKU CH-V54H-9TCM6

Thermal pad measuring 120 by 120 millimetres with 12 W/mK conductivity and 2.0 millimetre thickness for PCBs and SMD components

  • 12 W/mK thermal conductivity moves heat efficiently from hot components
  • 120 x 120 mm sheet covers large PCB areas in one piece
  • 0 mm thickness bridges uneven surfaces and height differences
  • Soft pad conforms to microcontrollers, memory ICs and MOSFETs without pressure
  • Easy to cut and place on GPUs, laptops and game consoles

High-conductivity thermal pad

The GELID SOLUTIONS GP-Extreme is a 12 W/mK thermal pad measuring 120 mm by 120 mm with a 2.0 mm thickness. It targets builders and technicians who need reliable heat transfer between uneven component surfaces and heatsinks.

Flexible sheet for mixed-height components

The soft pad conforms to PCBs with varying component heights such as MOSFETs, memory ICs and microcontrollers. Its square format allows easy cutting to fit graphics cards, laptops, game consoles or other compact assemblies without requiring paste application.

Replaces paste on non-flat interfaces

This pad substitutes thermal grease where surface gaps exceed what paste can bridge, especially on boards with tall and short components side by side. The upgrade is worthwhile when a uniform-thickness interface simplifies assembly and maintains consistent pressure across all contact points.

Highlights

  • 12 W/mK thermal conductivity moves heat efficiently from hot components
  • 120 x 120 mm sheet covers large PCB areas in one piece
  • 0 mm thickness bridges uneven surfaces and height differences
  • Soft pad conforms to microcontrollers, memory ICs and MOSFETs without pressure
  • Easy to cut and place on GPUs, laptops and game consoles

Specifications

No published specifications for this item yet.

Questions about this item

What does the 12 W/mK thermal conductivity mean for real-world heat transfer?

The 12 W/mK rating indicates high heat conduction capability, allowing the pad to efficiently move heat from components like MOSFETs and memory ICs to a heatsink across uneven PCB surfaces.

Will the 120 mm by 120 mm sheet with 2.0 mm thickness fit my GPU memory modules?

The 120 mm square can be cut to size for GPU memory, VRM or other SMD components; the 2.0 mm thickness bridges larger gaps between chip surfaces and the cooler base.

How do I install the pad without trapping air bubbles?

Clean both surfaces, peel the protective film, place the pad flat onto the component, then press the heatsink down evenly so the soft material conforms without voids.

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