GELID SOLUTIONS GP-Extreme 120×20 mm 2.5 mm thermal pad

120×20 mm 2.5 mm thermal pad

The GELID SOLUTIONS GP-Extreme is a thermal interface pad designed for PCBs with height differences and uneven surfaces. It targets builders and technicians working on graphics cards, laptops or gaming consoles where components sit at varying heights. The pad is non-electrically conductive, non-corrosive, non-curing and non-toxic for safe handling. Its softness allows it to fill gaps around memory ICs, MOSFETs and other SMD parts effectively.

Thermal conductivity and application limits

The pad is rated at 12 W/mK conductivity and 2.5 mm thickness to bridge larger gaps between dies and heatsinks. It works best on flat or slightly uneven surfaces such as VRM arrays, RAM modules and M.2 SSD controllers. Because the material is soft, it conforms without excessive pressure that could damage delicate packages. The 120×20 mm sheet covers broad areas but cannot replace thin paste on tightly clamped CPU dies. Users needing sub-millimetre bond lines should choose a different compound.

Replaces standard pads on high-density boards

This pad upgrades from thinner or lower-conductivity sheets when component stacks exceed typical heights. The jump is worth it when stock pads leave air gaps on tall MOSFETs or memory chips, causing throttling. It also replaces makeshift stacks of multiple thin pads that can shift over time. Builders who only need a thin layer for a standard CPU or GPU core will not benefit from the extra thickness.