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Grey thermal putty in a 50 g syringe, soft pliable paste form factor

GELID SOLUTIONS

GELID SOLUTIONS GN-Ultimate 6W Thermal Putty 50 g

SKU CH-M5ZP-2VSGS

Thermal putty with 6 W/mK conductivity fills gaps between multiple chips and a shared heatsink in a 50 g tube without curing or bleeding

  • High thermal conductivity rated at 6 W/m·K for efficient heat transfer
  • Non-electrically conductive formula prevents short circuits on exposed components
  • Non-curing putty stays pliable with no bleeding over time
  • Strong shaping ability allows precise gap filling across uneven surfaces
  • 50 g syringe provides enough material for multiple chip applications

Product Identity

GELID SOLUTIONS GN-Ultimate 6W Thermal Putty is a 50 g tube of non-curing, non-electrically conductive compound. It suits builders and technicians who need a putty-like material for gap filling between multiple chips and a shared heatsink. The 6 W/mK conductivity rating supports high thermal conductivity across uneven surfaces. It is not for users who prefer a traditional liquid paste for direct die applications.

Thermals Noise Power

The putty achieves low thermal resistance and an ultra-thin bond line under mounting pressure. Its non-curing formula prevents drying out and eliminates pump-out or bleeding over time. Being non-electrically conductive removes the risk of short circuits if excess material contacts surrounding components. No moving parts or power draw are involved in its operation.

Deciding Specification

The thermal conductivity is rated at 6 W/mK. This figure determines whether the material meets the heat-transfer requirement for a specific multi-chip cooling layout. Buyers who need a higher conductivity value should verify that this rating satisfies their thermal budget before purchasing.

Highlights

  • High thermal conductivity rated at 6 W/m·K for efficient heat transfer
  • Non-electrically conductive formula prevents short circuits on exposed components
  • Non-curing putty stays pliable with no bleeding over time
  • Strong shaping ability allows precise gap filling across uneven surfaces
  • 50 g syringe provides enough material for multiple chip applications

Specifications

No published specifications for this item yet.

Questions about this item

How do I apply the GN-Ultimate 6W Thermal Putty to ensure the ultra-thin layer forms correctly?

Place the putty on the component, mount the heatsink, and apply even pressure; the material compresses to an ultra-thin layer without curing or bleeding.

Will the GN-Ultimate 6W Thermal Putty dry out or need replacing after extended use?

The non-curing formula stays pliable and does not bleed, so it does not dry out or require scheduled replacement.

At what thermal load does the 6 W/mK conductivity become the limiting factor for heat transfer?

The 6 W/mK conductivity handles typical multi-chip loads; the limit appears first at extreme sustained power where the putty's thermal resistance dominates.

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