Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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GELID SOLUTIONS
Thermal putty with 6 W/mK conductivity fills gaps between multiple chips and a shared heatsink without curing or bleeding
This thermal putty delivers high conductivity rated at 6 W/mK for efficient heat transfer. The non-curing formula stays pliable and will not bleed over time. It is non-electrically conductive for safe application around sensitive components. The material offers strong shaping properties to fill gaps between uneven surfaces.
Verify that your heat sink applies enough pressure to compress the putty into an ultra-thin layer. Ensure the mating surfaces are clean and free of old compound residue before applying. Confirm the component layout allows a single heat sink to contact multiple chips simultaneously. The putty is designed for gap-filling scenarios rather than standard CPU-to-cooler interfaces.
Ideal for notebook mods, GPU memory modules, or VRM arrays sharing a common cooler. Not suited for users who prefer a traditional paste for a single CPU die. Buyers needing a curing pad that sets solid should look elsewhere. Anyone requiring electrical conductivity for a specific circuit must choose a different material.
No published specifications for this item yet.
The package contains a 30 g syringe of GN-Ultimate thermal putty; no spatula, spreader or cleaning wipes are included.
The 30 g syringe covers multiple applications on standard desktop processors and graphics cards, providing enough material for several reapplications.
The 6 W/m·K putty fills microscopic gaps and conforms under pressure, lowering thermal resistance between the die and heat spreader for measurable temperature drops.
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