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Grey thermal putty in a 50 g syringe tube

GELID SOLUTIONS

GELID SOLUTIONS GN-Ultimate 4W Thermal Putty 50 g

SKU CH-F9JF-MYXPV

Thermal putty fills gaps across multiple chips with 4 W/mK conductivity in a 50 g syringe

  • High heat transfer with 4 W/m·K conductivity
  • Safe on components thanks to non-electrical conduction
  • Stays pliable without curing or bleeding over time
  • Easy to shape and position during installation
  • 50 g tube covers multiple CPU or GPU applications

Product Identity

GELID SOLUTIONS GN-Ultimate 4W Thermal Putty is a high-conductivity thermal compound supplied in a 50 g container. It is designed for PC builders and technicians who need reliable heat transfer between multiple components and a shared heatsink. The non-electrically conductive formula eliminates the risk of short circuits during application. Its putty consistency allows it to conform to uneven surfaces and varying gap heights.

Build Integration

The material remains non-curing and shows no bleeding over time, so it maintains consistent performance without drying out or migrating onto surrounding components. Strong shaping properties let it hold its form during assembly, making it easier to position on irregular surfaces. Because it achieves an ultra-thin layer under pressure, it minimises thermal resistance without requiring precise thickness control. It is compatible with both Intel and AMD platforms.

Target Users

This putty suits enthusiasts and repair shops filling larger gaps between dies and a common cooler, such as on graphics cards or laptop motherboards. Buyers who prefer a traditional low-viscosity paste for standard CPU installations may find the thicker consistency less convenient. Those needing a curing adhesive or a phase-change pad should consider alternative product types.

Highlights

  • High heat transfer with 4 W/m·K conductivity
  • Safe on components thanks to non-electrical conduction
  • Stays pliable without curing or bleeding over time
  • Easy to shape and position during installation
  • 50 g tube covers multiple CPU or GPU applications

Specifications

No published specifications for this item yet.

Questions about this item

How thin can the GN-Ultimate 4W putty layer become under sustained clamping pressure?

The putty achieves an ultra-thin effect under pressure, allowing low thermal resistance across multiple chips sharing one heat sink.

Does the putty cure, bleed or conduct electricity during continuous all-day operation?

It is non-curing, non-bleeding and non-electrically conductive, so it stays stable and safe during extended use.

What heat-sink mounting hardware must already be in place to apply this 50 g syringe of putty?

A compatible cooler with sufficient clamping force is required to compress the putty to its ultra-thin state.

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