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Grey thermal putty in a 30 g syringe tube

GELID SOLUTIONS

GELID SOLUTIONS GN-Ultimate 4W Thermal Putty 30 g

SKU CH-NP85-XEHKP

Thermal putty fills gaps between multiple chips and a shared heatsink with high conductivity

  • High thermal conductivity rated at 4 W/m·K
  • Non-electrically conductive for safe application on sensitive components
  • Non-curing formula with no bleeding ensures long-term stability
  • Strong shaping properties allow precise gap filling
  • 30 g syringe provides ample material for multiple installations

What it is

GELID SOLUTIONS GN-Ultimate 4W Thermal Putty is a thermal compound supplied in a 30 g container. It is designed for gap filling between multiple chips and a shared heat sink. The material achieves low thermal resistance and an ultra-thin effect when compressed. It suits builders who need a versatile interface material for complex cooling layouts.

Key specification

The putty delivers a thermal conductivity of 4 W/mK. It is non-electrically conductive, non-curing and formulated to prevent bleeding. Strong shaping properties allow it to conform to uneven surfaces without flowing away over time. This single conductivity figure determines whether the material meets your thermal budget.

Who it suits

Enthusiasts and technicians who need a putty that bridges varying component heights on a single cooler will benefit. Builders who prefer a traditional grease for direct die-to-heatspreader applications should look at something else. Users requiring a specific conductivity value not listed here should verify their requirements before purchasing.

Highlights

  • High thermal conductivity rated at 4 W/m·K
  • Non-electrically conductive for safe application on sensitive components
  • Non-curing formula with no bleeding ensures long-term stability
  • Strong shaping properties allow precise gap filling
  • 30 g syringe provides ample material for multiple installations

Specifications

No published specifications for this item yet.

Questions about this item

How does the 4 W/mK conductivity perform once the putty is installed between a chip and a heatsink?

The 4 W/mK rating delivers low thermal resistance and an ultra-thin bond line under pressure, so heat transfers efficiently across the interface.

Is the material electrically conductive and could it cause a short if it touches exposed circuitry?

It is non-electrically conductive, so accidental contact with components or traces will not create a short circuit.

What does the 30 g syringe provide for mounting on multiple chips sharing one heatsink?

The 30 g volume lets you shape and apply enough putty to fill gaps across several dies while maintaining a thin, even layer under the shared cooler.

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