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Grey thermal putty in a 30 g syringe tube

GELID SOLUTIONS

GELID SOLUTIONS GN-Ultimate 10W Thermal Putty 30 g

SKU CH-NQ1D-847ER

Thermal putty fills gaps between multiple chips and a shared heatsink with 10 W/m·K conductivity in a 30 g syringe

  • High thermal conductivity of 10 W/m·K for efficient heat transfer
  • Non-electrically conductive formula prevents short circuits on components
  • Non-curing putty stays pliable and eliminates bleeding over time
  • Strong shaping ability fills gaps between uneven surfaces
  • 30 g syringe provides enough material for multiple applications

Ultimate Heat Conductivity Putty

GELID SOLUTIONS GN-Ultimate is a 10W thermal putty supplied in a 30 g container. It provides high thermal conductivity for efficient heat transfer between components and coolers. The non-electrically conductive formula eliminates the risk of short circuits during application. It is designed for builders seeking a versatile gap-filling material.

Non-Curing Formula Upgrade

Unlike traditional greases that can dry out or pump out over time, this putty features a non-curing and no-bleeding composition. It maintains consistent performance without hardening or migrating away from the contact area. The jump is worth it when long-term stability and clean maintenance are priorities. Strong shaping properties allow it to conform to uneven surfaces easily.

Multi-Chip Gap Filling Suitability

This putty suits users cooling multiple chips with a single heatsink where an ultra-thin bond line under pressure is required. It is not for buyers who need a low-viscosity paste for standard CPU-only applications. It is also not for builders who prefer a fluid compound that spreads automatically without manual shaping.

Highlights

  • High thermal conductivity of 10 W/m·K for efficient heat transfer
  • Non-electrically conductive formula prevents short circuits on components
  • Non-curing putty stays pliable and eliminates bleeding over time
  • Strong shaping ability fills gaps between uneven surfaces
  • 30 g syringe provides enough material for multiple applications

Specifications

No published specifications for this item yet.

Questions about this item

What gap thickness can the 10 W thermal putty fill?

The putty conforms under pressure to achieve an ultra-thin bond line between multiple chips and a shared heat sink.

How do I apply the non-curing putty without creating air pockets?

Press the putty evenly across each die so it spreads into a thin layer; the material does not cure or bleed, so rework is simple.

Will the 30 g syringe need replacement after repeated GPU swaps?

The non-curing formula stays pliable, so the same portion can be reused each time you reseat a cooler.

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