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Small 1.0g syringe of white thermal paste

GELID SOLUTIONS

GELID SOLUTIONS GC-4 1.0g thermal paste

SKU CH-MBTG-B5JYX

A 1.0 g syringe of non-curing thermal compound rated from -30 to 150 °C for CPU, GPU and chipset heat transfer

  • Volume / Net Weight1.0g
  • Ultra-efficient heat transfer for CPUs, GPUs and chipsets
  • Stable performance across a -30 °C to 150 °C operating range
  • Micron-particle synthetic filler and polymer matrix ensure maximum conductivity
  • Non-curing formula maintains consistent performance over time
  • Optimal viscosity allows perfect gap filling with 1.0 g net weight

1.0g Thermal Compound for CPUs and GPUs

This 1.0g syringe of GC-4 thermal paste is designed for PC builders and technicians who need reliable heat transfer between a processor or graphics chip and its cooler. The micron-particle synthetic filler and polymer matrix create a consistent interface for CPUs, GPUs and chipsets in standard desktop systems. The small volume suits single installations or occasional maintenance work.

Easy Application with Stable Viscosity

The compound’s optimal viscosity allows smooth spreading without excessive force, reducing the risk of air bubbles during installation. Its non-curing formula remains pliable across a wide temperature range from -30 to 150 C, so it will not dry out or become brittle over time. The syringe format helps control the amount applied, avoiding the mess that can occur with larger tubs.

Check Cooler Mounting and Surface Condition

Before ordering, verify that your cooler’s mounting hardware provides even pressure across the die or heat spreader, as uneven force can compromise the thermal interface. Ensure both mating surfaces are clean and free of old paste residue to allow the micron-particle filler to fill microscopic gaps effectively. The 1.0g volume covers one typical desktop application; larger or multiple installations will require additional syringes.

Highlights

  • Ultra-efficient heat transfer for CPUs, GPUs and chipsets
  • Stable performance across a -30 °C to 150 °C operating range
  • Micron-particle synthetic filler and polymer matrix ensure maximum conductivity
  • Non-curing formula maintains consistent performance over time
  • Optimal viscosity allows perfect gap filling with 1.0 g net weight

Specifications

BrandGELID Solutions
Volume / Net Weight1.0g

Questions about this item

How can I confirm the GC-4 paste is working correctly after applying it to my CPU?

Monitor CPU temperatures under load; they should remain stable and within the expected range for your cooler, showing the paste is transferring heat efficiently across the -30 to 150 C operating window.

What does the GC-4 1.0g package contain and do I need any extra tools?

The package contains a 1.0g syringe of GC-4 thermal compound; no additional tools are included, so you may want a lint-free cloth and isopropyl alcohol for surface preparation.

Is the 1.0g syringe enough for a single CPU application or should I buy more?

A 1.0g syringe typically covers multiple standard CPU applications using a pea-sized dot, so one unit is sufficient for a single build with spare left over.

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