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Fans

Fans Dual Fan Copper Cooling Kit Raspberry Pi 3 2 B+ NESPi Retroflag

SKU CH-JZQ7-ENFBZ

Dual-fan copper cooling kit compatible with Raspberry Pi 3, 2, Model B+, NESPi and Retroflag cases

  • Dual fans increase airflow to lower operating temperatures
  • Copper heatsinks conduct heat away from the processor efficiently
  • Designed for Raspberry Pi 3, 2 Model B and B+ boards
  • Compatible with NESPi and Retroflag cases for drop-in fit

Dual-fan copper kit for Raspberry Pi cases

This dual-fan cooling kit adds active airflow to Raspberry Pi 3 Model B, 2 Model B, B+ and compatible NESPi or Retroflag enclosures. Two low-noise fans mount directly over the board to draw heat away from the CPU and RAM. Copper shims conduct heat from the main chips to the fan path without thermal paste. The kit suits hobbyists who run sustained workloads or emulation inside a closed case.

Limited by 5 V GPIO power and case clearance

Fans draw 5 V from the Pi’s GPIO header, so airflow scales with the board’s own current budget and cannot exceed what the header supplies. Copper shims only bridge the gap to the stock chip heights; taller heatsinks or HATs will block the fans. The kit fits the named cases only — other enclosures may lack mounting points or internal height for the dual-fan stack.

Highlights

  • Dual fans increase airflow to lower operating temperatures
  • Copper heatsinks conduct heat away from the processor efficiently
  • Designed for Raspberry Pi 3, 2 Model B and B+ boards
  • Compatible with NESPi and Retroflag cases for drop-in fit

Specifications

No published specifications for this item yet.

Questions about this item

Is the dual-fan copper kit the only version available for my Raspberry Pi 3 Model B+?

Yes, this single kit includes two fans and copper heatsinks designed specifically for the Raspberry Pi 3, 2, Model B+, NESPi and Retroflag cases.

How much will the copper heatsinks and dual fans lower my Pi's temperature under load?

The copper heatsinks draw heat from the SoC and RAM while the two fans push air across them, keeping the board significantly cooler than passive cooling alone during sustained workloads.

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