Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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EN-Labs
High-conductivity 16.8 W/mK silicone pad transfers heat from CPU, GPU and other components while remaining electrically non-conductive
This thermal pad measures 85 by 45 by 1.5 millimetres and delivers 16.8 W/mK thermal conductivity. The non-conductive silicone material is rated at 3.6 g/cc density with 30 to 50 Shore C hardness. It suits CPU, GPU, power LED, control board and similar heat-transfer tasks.
The pad can be trimmed freely to fill contact-surface gaps without the mess of traditional grease paste. Electrical insulation exceeds 10 kV breakdown voltage, so it isolates components while conducting heat. No corrosive agents are present, making it safe for laptop heatsinks, set-top boxes and automotive electronics alike.
Gray silicone maintains its physical properties under continuous load without drying out or pumping out like liquid compounds. The 1.5 millimetre thickness bridges uneven mating surfaces while the 16.8 W/mK rating moves heat steadily away from the die. Builders needing thinner or thicker gaps must select a different pad specification.
No published specifications for this item yet.
The pad is rated at 16.8 W/mK thermal conductivity, which governs how quickly heat moves across the 1.5 mm thickness during continuous use.
The material is a solid non-conductive silicone pad with no moving parts, so it adds no audible noise and its 16.8 W/mK conductivity helps keep temperatures lower.
A mating heatsink or cooler surface and a chip package such as a CPU, GPU or power LED that fits within the 85x45 mm area are required for the pad to bridge the gap.
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