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Blue thermal pad 100x100x5.0mm soft silicone square

EN-Labs

EN-Labs Thermal Pad 100x100x5.0mm 3.2W/M-K Blue

SKU CH-3F5P-X0WWG

A 100 x 100 x 5.0 mm blue silicone thermal pad rated at 3.2 W/m-K for filling gaps between chips and heatsinks

  • FeaturesSelection of thermal silica film main objective is to reduce
  • Reduces contact thermal resistance between surfaces
  • 2 W/m-K thermal conductivity for efficient heat transfer
  • 0 mm thickness fills larger component gaps
  • Electrically insulating with >4 kV breakdown voltage
  • Operates from -40 °C to 200 °C

EN-Labs Thermal Pad 5mm Thickness

This 100x100mm silicone thermal pad suits DIY repairs on GPUs, northbridge chips, LED modules and similar components needing a 5.0mm gap fill. Its 3.2 W/m-K conductivity targets moderate heat-transfer tasks in consumer electronics and PC builds. The blue colour aids visual identification during assembly.

Soft Conductive Silicone Build

The pad’s malleable texture conforms to uneven surfaces without mess, while slight tackiness holds it in place during installation. Electrical insulation rated above 4 kV breakdown voltage protects adjacent circuitry, and tensile strength of 180 kgf/cm² resists tearing when repositioning. Continuous operating range spans -40 °C to 200 °C for demanding environments.

Fixed Thickness Limits Reuse

At 5.0mm thick the pad cannot accommodate thinner gaps without compression that may reduce performance or stress components. Builders needing different gap sizes must source separate thicknesses, and the single 100x100mm sheet yields limited coverage for larger heatsinks or multiple devices.

Highlights

  • Reduces contact thermal resistance between surfaces
  • 2 W/m-K thermal conductivity for efficient heat transfer
  • 0 mm thickness fills larger component gaps
  • Electrically insulating with >4 kV breakdown voltage
  • Operates from -40 °C to 200 °C

Specifications

FeaturesSelection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface use for Control board, the motor, electronics, auto mechanics, computer host, laptops, DVD, VCD, LID, set-top boxes ,LED IC SMD DIP and any cooling module needs to be filled and materials for electrical and electronic products. Soft,good malleability,with a little viscosity. Strong insulation and Excellent performance. Provide a mess-free installation, maximum

Questions about this item

What thermal conductivity does the 5.0 mm pad provide?

The pad conducts heat at 3.2 W/m-K, moving warmth from GPU, northbridge or LED chips into the heatsink across the full 100 x 100 mm surface.

How much clearance does the 100 x 100 x 5.0 mm pad need?

It requires a flat mating area at least 100 mm square with a 5.0 mm gap between component and cooler; the soft silicone compresses slightly to fill uneven surfaces.

How do I install the pad without trapping air bubbles?

Clean both surfaces, peel the protective film, lay the pad evenly from one edge to the other, then press the heatsink down firmly so the slight viscosity spreads the material without gaps.

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