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Blue square thermal pad, 100 by 100 mm, 3.0 mm thick

EN-Labs

EN-Labs Thermal Pad 100x100x3.0mm 3.2W/mK Blue

SKU CH-56KR-13582

A 100 x 100 x 3.0 mm blue silicone thermal pad rated at 3.2 W/m·K conductivity for GPU, chipset and LED cooling

  • FeaturesSelection of thermal silica film main objective is to reduce
  • Reduces contact thermal resistance between components and heatsinks
  • 2 W/m·K thermal conductivity for efficient heat transfer
  • Soft, malleable silicone pad with light tack for mess-free fitting
  • Electrically insulating with >4 kV breakdown voltage
  • Operates reliably from -40 °C to 200 °C

100×100×3.0 mm thermal pad for ICs and heatsinks

This blue silicone pad measures 100 mm by 100 mm with a 3.0 mm thickness. It is designed to fill gaps between heat sources such as GPU chips, northbridge ICs, LED modules or chipset components and their heatsinks. The material is soft, malleable and slightly tacky for mess-free placement.

3.2 W/m·K conductivity with >4 kV insulation

Rated at 3.2 W/m·K thermal conductivity, the pad handles typical IC and LED cooling loads while providing electrical insulation above 4 kV breakdown voltage. It operates continuously from -40 °C to 200 °C and offers tensile strength of 180 kgf/cm². The 3.0 mm thickness suits larger gaps but will not conform to very thin interfaces.

Silicone pad limits for high-power or automated use

As a standard silicone interface, it lacks the ultra-high conductivity of premium graphite or liquid-metal compounds for extreme overclocking. The material is supplied as a single 100×100 mm sheet requiring manual cutting for smaller dies. It is not suited for applications demanding sub-millimetre bond lines or automated dispensing.

Highlights

  • Reduces contact thermal resistance between components and heatsinks
  • 2 W/m·K thermal conductivity for efficient heat transfer
  • Soft, malleable silicone pad with light tack for mess-free fitting
  • Electrically insulating with >4 kV breakdown voltage
  • Operates reliably from -40 °C to 200 °C

Specifications

FeaturesSelection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface use for Control board, the motor, electronics, auto mechanics, computer host, laptops, DVD, VCD, LID, set-top boxes ,LED IC SMD DIP and any cooling module needs to be filled and materials for electrical and electronic products. Soft,good malleability,with a little viscosity. Strong insulation and Excellent performance. Provide a mess-free installation, maximum

Questions about this item

Will this 3.0 mm thick pad bridge the gap between my existing heatsink and GPU die?

The pad is 3.0 mm thick and 100 x 100 mm, so it fills gaps up to that height; trim it to match the die size if the chip is smaller.

How can I confirm the 3.2 W/m·K conductivity is effective once installed?

Monitor component temperatures under load; a drop toward the expected thermal resistance for 3.2 W/m·K material at 3.0 mm thickness indicates proper contact.

Does the package include adhesive or tools, or must I buy them separately?

The pad is a single 100 x 100 x 3.0 mm blue silicone sheet with natural tackiness; no adhesive, cutting tool or cleaning wipes are included.

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