Innovation First, Inc. 1UCMA-137 1U Cable Management Arm 19" 28.5"-33" computer accessory
- Product Type:Cable…
- Panel Width:19" Rac…
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EN-Labs
Non-conductive silicone thermal pad measuring 85 by 45 by 1.0 mm with 16.8 W/mK conductivity and 10 kV breakdown voltage
This thermal pad delivers 16.8 W/mK conductivity to transfer heat away from processors, graphics chips and power electronics. The non-conductive silicone material eliminates the risk of short circuits while filling microscopic gaps between components and heatsinks. It suits both laptop repairs and desktop upgrades where reliable thermal coupling is essential.
At 16.8 W/mK the pad moves heat far faster than standard pads, making it the single figure that determines whether it meets a design's thermal budget. The 1.0 mm thickness matches many factory gaps, and the 85 by 45 mm sheet can be trimmed to exact shapes without waste. Breakdown voltage exceeds 10 KV per millimetre for electrical safety.
The silicone base retains its 3.6 g/cc density and 30 to 50 Shore C hardness after prolonged heating cycles, so contact pressure and conductivity stay consistent. Unlike grease that can pump out or dry up, the solid pad maintains its interface without degradation. Non-corrosive chemistry protects copper and aluminium surfaces throughout the product's service life.
No published specifications for this item yet.
The 16.8 W/mK conductivity rating shows the pad transfers heat efficiently between the chip and cooler, helping lower operating temperatures when applied correctly.
The pad withstands over 10 kV per millimetre, so the 1.0 mm thickness blocks electrical conduction across high-voltage areas on the PCB.
The pad measures 85 mm by 45 mm by 1.0 mm and can be cut to size, making it suitable for laptop GPU dies, VRAM modules and other small contact surfaces.
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