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Ten thin copper squares 15 by 15 by .4 mm with a shiny metallic finish

EN-Labs

EN-Labs DIY Cooling Copper Shim 15x15x.4mm 10pcs

SKU CH-WD47-C06C9

Ten copper shims measuring 15 by 15 by 0.4 mm fill gaps between laptop BGA chips and heatsinks, each rated at 401 W/mK thermal conductivity

  • CompatibilityCPU
  • MaterialCopper
  • FeaturesThis Copper Shims thermal conductivity up to 401w / mk, and
  • Dimensions15mm x 15mm x 0.4mm
  • High thermal conductivity up to 401 W/mK for efficient heat transfer
  • Thin 0.4 mm profile fits tight gaps between chip and heatsink
  • 15 mm square size suits BGA CPU, GPU and memory packages
  • Copper construction resists ageing unlike thermal pads that degrade over time
  • Pack of 10 shims covers multiple components or future repairs

Targeted Laptop Chip Cooling

This pack of ten copper shims measures 15mm by 15mm by .4mm and is intended for DIY thermal management on laptop BGA processors, graphics chips, memory ICs and similar components. The copper construction provides a thermal conductivity rating of 401 W/mK, far above the 20 to 30 W/mK of ordinary copper. Builders and repair technicians can use them to replace aged thermal pads or fill gaps between dies and heatsinks.

Build Integration

Each shim sits directly on a bare die or chip package inside a laptop chassis, requiring no adhesive and no additional mounting hardware beyond the existing heatsink assembly. The thin .4mm profile allows installation in tight spaces where standard thermal pads would be too thick. Using these shims frees the builder from relying on degrading thermal compounds that lose effectiveness over time.

Thermals and Power

Copper’s high conductivity spreads heat quickly across the 15mm square surface, helping the laptop’s heatsink and fan dissipate energy more evenly during sustained loads. The material adds no active power draw and introduces no moving parts, so acoustic output remains unchanged. In normal use the shims maintain stable contact pressure, reducing the risk of overheating shutdowns caused by aged thermal interfaces.

Highlights

  • High thermal conductivity up to 401 W/mK for efficient heat transfer
  • Thin 0.4 mm profile fits tight gaps between chip and heatsink
  • 15 mm square size suits BGA CPU, GPU and memory packages
  • Copper construction resists ageing unlike thermal pads that degrade over time
  • Pack of 10 shims covers multiple components or future repairs

Specifications

CompatibilityCPU
MaterialCopper
FeaturesThis Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic
at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the
Laptop will not start after overheating. And this copper heat sink solve thermal problems caused by frequent crashes laptop, etc
Package included:
10 pcs Thermal Conductive Copper Shims 15mm x 15mm x 0.4mm
Dimensions15mm x 15mm x 0.4mm

Questions about this item

How thin is each copper shim so it fits between a laptop die and the heatsink?

Each shim measures 15 mm by 15 mm and is 0.4 mm thick, so it slides into tight gaps between a BGA chip and the cooler.

Will ten copper shims add noticeable weight or heat to a laptop running all day?

The shims are passive copper pieces with 401 W/m·K conductivity; they add negligible mass and simply spread heat faster without generating any noise or extra power draw.

What else do I need besides these shims to complete a laptop BGA rework?

You will still need thermal paste or liquid metal to fill microscopic voids, plus the usual disassembly tools and a compatible heatsink for the specific laptop model.

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