EN-Labs
EN-Labs Copper Heatsinks 14x14x3mm 2.0 W/mK Pack of 4
Four 14 × 14 × 3 mm copper heatsinks with 2.0 W/mK thermal adhesive tape cool motherboard chipsets, GPU memory and DDR2/DDR3 modules
- Pure copper conducts heat up to 401 W/mK for faster chip cooling
- 0 W/mK adhesive tape bonds securely without extra hardware
- Four 14×14×3 mm shims cover CPU, GPU, RAM and chipset
- Fits DDR2 and DDR3 modules plus console BGA processors
- Low 0.12" profile clears tight laptop and board spaces
Copper heatsinks for BGA chips
Four 14 mm square copper shims come with pre-applied 2.0 W/mK thermal adhesive tape. They attach directly to memory ICs, southbridge chips or console processors without screws or clips. The pure copper body conducts heat at up to 401 W/mK, far above aluminium alternatives. Builders repairing laptops or legacy consoles gain a drop-in cooling upgrade.
Passive thermal performance
Heat spreads through the 3 mm copper thickness and radiates from the 14 x 14 mm surface area. No fan is required, so the solution adds zero acoustic noise and draws no power. The silicone-based adhesive tape remains stable through repeated thermal cycles in normal desktop or console use. Temperatures drop measurably on DDR2 and DDR3 modules as well as on Xbox 360 and PlayStation 2, 3 and 4 BGA packages.
Adhesive tape simplifies installation
Each heatsink ships with the thermal tape already mounted, removing the need for separate paste or pads. The tape bonds instantly on contact and fills microscopic gaps for consistent 2.0 W/mK transfer. No curing time or clamping hardware is involved, so repairs finish in minutes. The pack of four covers multiple chips on a single board or several different devices.
Highlights
- Pure copper conducts heat up to 401 W/mK for faster chip cooling
- 0 W/mK adhesive tape bonds securely without extra hardware
- Four 14×14×3 mm shims cover CPU, GPU, RAM and chipset
- Fits DDR2 and DDR3 modules plus console BGA processors
- Low 0.12" profile clears tight laptop and board spaces
Specifications
No published specifications for this item yet.
Questions about this item
How do I install the 14×14×3 mm copper heatsinks with the included 2.0 W/mK adhesive tape?
Peel the protective liner, press the tape onto the clean chip surface, then attach the heatsink; the step often missed is removing both liners so the adhesive bonds directly to the component.
Will the 2.0 W/mK thermal tape need replacement after extended use?
The silicone-based adhesive tape can dry out or lose tack after repeated thermal cycles; plan to replace it if heatsinks become loose or temperatures rise.
At what point does the 2.0 W/mK tape become the thermal bottleneck under sustained load?
The tape’s 2.0 W/mK conductivity limits heat flow long before the 401 W/mK copper body saturates, so sustained high-power chips hit this interface limit first.
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