EN-Labs
EN-Labs 8pcs Copper Heatsink 14x12x5.5mm Self-Stick DIY Cooling
Eight self-adhesive copper heatsinks measuring 14 by 12 by 5.5 mm for GPU, RAM and chipset cooling
- Solid copper conducts heat up to 401 W/m·K
- Self-stick tape allows quick, tool-free mounting
- Eight pieces cover multiple memory chips and BGA packages
- Fits DDR2 and DDR3 modules as well as GPU and motherboard ICs
- 14 × 12 × 5.5 mm size suits tight board clearances
Copper shims for memory and chip cooling
This set contains eight solid copper heatsinks measuring 14 by 12 by 5.5 millimetres. They are intended for DIY thermal management on graphics cards, motherboards and laptops. The adhesive backing allows direct attachment to RAM chips, VRM components or BGA processors. Enthusiasts upgrading older consoles such as the Xbox 360 or PlayStation 3 can also use them.
Thermal conductivity and silent operation
Each shim offers a rated thermal conductivity of up to 401 watts per metre kelvin, moving heat away from the component into the copper mass. Because there are no moving parts, the solution adds zero acoustic noise to the system. The self-stick tape is designed to stay in place during normal thermal cycling. Power draw is unaffected as the heatsinks are entirely passive.
Fits tight spaces around DDR2 and DDR3 modules
The low 5.5 millimetre profile lets the shims sit under cramped GPU shrouds or between tightly spaced memory sticks. They require a clean, flat surface for the adhesive to bond reliably. No extra mounting hardware, thermal paste or external power is needed. Builders needing larger contact areas or active airflow must look elsewhere.
Highlights
- Solid copper conducts heat up to 401 W/m·K
- Self-stick tape allows quick, tool-free mounting
- Eight pieces cover multiple memory chips and BGA packages
- Fits DDR2 and DDR3 modules as well as GPU and motherboard ICs
- 14 × 12 × 5.5 mm size suits tight board clearances
Specifications
No published specifications for this item yet.
Questions about this item
How do I install the 14x12x5.5mm copper heatsinks on RAM chips and what step is often missed?
Clean the chip surface, peel the self-stick backing, press each heatsink firmly for several seconds, and ensure full contact; the step often missed is skipping surface cleaning, which reduces adhesion and thermal transfer.
Will the self-stick adhesive on these copper heatsinks need replacement during the system's life?
The high-conductivity tape is designed to be removable and re-applied; if adhesion weakens after repeated heating cycles, replace it with a quality thermal tape of similar thickness to maintain the 401 W/m·K path.
What thermal limit appears first when these 5.5mm tall heatsinks run under sustained load?
The limiting factor is the heatsink's small 14x12mm footprint and 5.5mm height, which saturate quickly; the copper spreads heat fast at 401 W/m·K but cannot dissipate high continuous power without airflow.
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