EN-Labs
EN-Labs 10pcs 15x15mm Copper Heatsink Combo 0.1-1.2mm DIY Cooling
A set of ten 15×15 mm copper shims in thicknesses from 0.1 mm to 1.2 mm for DIY laptop CPU, GPU and memory cooling
- CompatibilityCPU
- MaterialCopper
- FeaturesThis Copper Shims thermal conductivity up to 401w / mk, and
- Dimensions15x15mm
- High thermal conductivity of 401 W/m·K transfers heat efficiently
- Eight thickness options from 0.1 mm to 1.2 mm fit varied gaps
- Ten-piece set covers multiple chips in one purchase
- Pure copper construction resists degradation better than thermal pads
- 15 mm square footprint suits laptop CPU, GPU and RAM ICs
Precision copper shims for laptop BGA chips
This set supplies ten 15x15 mm copper shims in thicknesses of .1, .3, .4, .5, .6, .8, 1.0 and 1.2 mm. The pieces are intended for DIY cooling of laptop CPU, GPU, VRAM and other BGA integrated circuits where a precise gap fill is required.
Thermal performance and material properties
Each shim is made from copper rated at 401 W/m·K conductivity, far above the 20-30 W/m·K of ordinary copper. The high conductivity moves heat away from the die into the heatsink without adding active components, so the modification adds no fan noise or extra power draw.
Installation context and build impact
The shims replace aged or missing thermal pads between the chip and the cooler, eliminating the pump-out and dry-out issues that cause throttling or shutdowns. Because the kit provides multiple thicknesses in one pack, builders can match the exact stack height needed without sourcing separate pads, freeing the repair from trial-and-error delays.
Highlights
- High thermal conductivity of 401 W/m·K transfers heat efficiently
- Eight thickness options from 0.1 mm to 1.2 mm fit varied gaps
- Ten-piece set covers multiple chips in one purchase
- Pure copper construction resists degradation better than thermal pads
- 15 mm square footprint suits laptop CPU, GPU and RAM ICs
Specifications
| Compatibility | CPU |
|---|---|
| Material | Copper |
| Features | This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the Laptop will not start after overheating. And this copper heat sink solve thermal problems caused by frequent crashes laptop, etc Purchase different thickness copper thermal pad you purpose one-step,default combination: 1 piece - 0.1mm |
| Dimensions | 15x15mm |
Questions about this item
How do I install these 15x15mm copper shims on a laptop BGA chip, and what step causes most issues?
Clean the die and heatsink, apply a thin layer of thermal paste on both faces of the chosen shim, then seat the heatsink evenly; the common mistake is stacking multiple thicknesses instead of picking the single 0.1mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.8mm, 1.0mm or 1.2mm piece that closes the gap exactly.
What maintenance or replacement will these copper shims need later?
Copper does not degrade like thermal pads; re-apply thermal paste only when you disassemble the heatsink for another reason — the 401 W/m·k shims themselves remain effective indefinitely.
What limit appears first under sustained load with these 15x15mm shims?
The bottleneck is the laptop heatsink and fan capacity, not the shim; copper conducts at 401 W/m·k, so the thermal path from die to ambient saturates before the shim does.
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