EN-Labs
EN-Labs 100 pcs 10×10×1.0 mm 3.2 W/mK thermal pad
Pack of 100 blue 10×10×1.0 mm silicone pads rated at 3.2 W/mK for filling gaps between chips and heatsinks
- FeaturesSelection of thermal silica film main objective is to reduce
- 100 pre-cut 10 × 10 × 1.0 mm pads speed up GPU and chipset installs
- 2 W/mK conductivity moves heat away from hot components efficiently
- Soft silicone with slight tack fills microscopic gaps for maximum contact
- Withstands −40 °C to 200 °C continuous operation without degrading
- >4 kV breakdown voltage plus 180 kgf/cm² tensile strength ensures electrical safety
100-piece thermal pad kit
This kit supplies one hundred pre-cut conductive silicone pads measuring 10 by 10 by 1.0 millimetres. Each pad offers thermal conductivity of 3.2 W/mK and a breakdown voltage above 4 kV. The blue material is soft, slightly tacky and electrically insulating. It suits control boards, LED modules, laptop internals and similar compact cooling tasks.
Sustained heat transfer up to 200 °C
The pads maintain performance across a continuous temperature range of minus 40 to 200 Celsius. Their tensile strength of 180 kgf/cm² resists mechanical stress during long-term compression. The silicone stays pliable and retains its gap-filling ability without drying out. This stability keeps thermal resistance low during extended operation.
Thickness and conductivity define the limit
A 1.0 millimetre thickness and 3.2 W/mK conductivity set the practical thermal resistance for this interface. Gaps larger than the pad thickness cannot be bridged without stacking, which adds resistance. The material is not intended for large-area CPU or GPU dies that demand higher conductivity or thinner bond lines. Users needing lower resistance must select a different specification.
Highlights
- 100 pre-cut 10 × 10 × 1.0 mm pads speed up GPU and chipset installs
- 2 W/mK conductivity moves heat away from hot components efficiently
- Soft silicone with slight tack fills microscopic gaps for maximum contact
- Withstands −40 °C to 200 °C continuous operation without degrading
- >4 kV breakdown voltage plus 180 kgf/cm² tensile strength ensures electrical safety
Specifications
| Features | Selection of thermal silica film main objective is to reduce the contact thermal resistance between the heat source and heat sink surfaces in contact surfaces. Gap thermal silica film can be well filled with the contact surface use for Control board, the motor, electronics, auto mechanics, computer host, laptops, DVD, VCD, LID, set-top boxes ,LED IC SMD DIP and any cooling module needs to be filled and materials for electrical and electronic products. Soft,good malleability,with a little viscosity. Strong insulation and Excellent performance. Provide a mess-free installation, maximum |
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Questions about this item
How much heat can the 3.2 W/mK thermal pad move when my GPU runs all day?
The pads conduct heat at 3.2 W/mK and stay stable from -40 °C to 200 °C, so they handle continuous GPU loads without drying out.
What do I need to have ready before installing these 10×10×1.0 mm pads on a graphics card?
You need a clean heatsink surface and the correct gap thickness; the 1 mm pads replace existing thermal material between the chip and cooler.
Will these blue silicone pads fit the older chipset and VRM chips I want to keep using?
Each 10×10 mm square covers common legacy chipsets and VRMs, and the soft 1 mm thickness conforms to uneven surfaces on older boards.
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